Evaluation of filling behavior on UV nanoimprint lithography using release coating

Osari, Kazutomo; Unno, Noriyuki; Taniguchi, Jun; Machinaga, Ken-ichi; Ohsaki, Takeshi; Sakai, Nobuji

doi:10.1016/j.mee.2009.11.175

Cited by 12 publications

(5 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…1(b)), is negative and generates a negative value of P c for pushing the resin upward. This negative value of P c has been confirmed at nano-scale feature size mold with RCL in [13]. The presence of RCL and ARS on molds lowers the surface energy and exacerbates the capillarity that complicates the fillings.…”

Section: Introductionmentioning

confidence: 67%

Lifetime amelioration of antireflection structure molds by means of partial-filling ultraviolet nanoimprint lithography

Talipa]Yusof

Hayashi

Taniguchi

et al. 2015

Microelectronic Engineering

Self Cite

View full text Add to dashboard Cite

Release coating layer (RCL) becomes an important element in ultraviolet nanoimprint lithography (UV-NIL) for preventing the adhesive resin from adhering to the surface of antireflection structures (ARS) mold. However, complete filling the resin of a high-aspect-ratio ARS mold during UV-NIL generates a strong release force (RF) that deteriorates the RCL and affects the lifetime of the ARS mold. In this paper, we proposed a technique of partial-filling UV-NIL in order to reduce the RF and consequently, ameliorate the lifetime of the ARS mold. The release and optical properties of the ARS were measured to determine the lifetime of the mold, and complete-filling UV-NIL was also executed for comparison. By means of partial-filling UV-NIL, we successfully fabricated ARS films with excellent performance up to the 150th imprint, i.e., reflectivity of 0.25 ± 0.15% and transmittance of 94.0 ± 0.50% at visible wavelengths, compared to complete-filling UV-NIL up to the 50th imprint.

show abstract

Section: Introductionmentioning

confidence: 67%

Lifetime amelioration of antireflection structure molds by means of partial-filling ultraviolet nanoimprint lithography

Talipa]Yusof

Hayashi

Taniguchi

et al. 2015

Microelectronic Engineering

Self Cite

View full text Add to dashboard Cite

show abstract

“…Moreover, a problem with NIL is that when the mold is subjected to mold-release treatment, the water repellency increases, and the resin does not fill the interior of the fine pattern [10][11][12]. This phenomenon was observed in our previous study using a bridge structure mold [13], which revealed that the filling height of the UV-curable resin depended on the NIL pressure. Our previous study used hydrogen silsesquioxane (HSQ) as the bridge structure, which is a negative-type electron-beam (EB) resist [14].…”

Section: Introductionmentioning

confidence: 89%

Filling Behavior Observation of UV-curable Resin Using Bridge-Structure Mold

Murakami,

Nagai,

Taniguchi

2023

J. Photopol. Sci. Technol.

Self Cite

View full text Add to dashboard Cite

In recent years, owing to the increasing demand for semiconductors, decreasing the power consumption of semiconductor-exposure equipment has become an important issue. Therefore, ultraviolet nanoimprint lithography (UV-NIL), which can efficiently produce nanopatterns with reduced power consumption, is desirable. However, the problem with UV-NIL is that when the mold is subjected to a mold-release treatment, the water repellency increases, and the resin does not fill the interior of the fine pattern. Therefore, investigating the filling behavior is essential. Our previous study used hydrogen silsesquioxane (HSQ) as the bridge structure, which is a negative-type electron-beam (EB) resist with a film thickness of 300 nm. Using HSQ, the height of the bridge structure was less than 300 nm, and a small amount of UV-curable resin was obtained. Therefore, thicker negative-type EB resists are required to address this issue. In this study, a negative-type photoresist was used as the bridge structure via EB lithography. Consequently, the height and thickness of the bridge were approximately 6 and 2 µm, respectively, and hence, we could comprehensively pursue the filling behavior.

show abstract

“…The SEM detects spatially resolved changes in the structure surface's energy. The topology can be reconstructed in a two-dimensional image [5]. Suppose a two-dimensional image is not sufficient to evaluate the imprint.…”

Section: Introductionmentioning

confidence: 99%

Non-destructive multi-parameter investigation of nanoimprinted structures

Burkert,

Schwörer,

Schubert

et al. 2024

Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII

View full text Add to dashboard Cite

In the field of optics, Nanoimprint Lithography (NIL) is frequently discussed as a cost-effective manufacturing technology for diffractive elements. Using polymer-based NIL structures, it is interesting to quantify their fidelity in the imprinting process. Electron microscopy images are commonly used for measurement purposes. However, there are several other measurement techniques suitable for assessing NIL structures. Each measurement technology has its specific advantages and disadvantages, which can complement the evaluation of NIL structures. Here alternative measurement methods such as white-light interferometry, atomic force microscopy, optical coherent tomography, micro-computed tomography, and environmental scanning electron microscope are investigated to evaluate NIL structures non-destructively and with respect to multiple parameters (e.g. topological, optical). The evaluation criteria include resolution, aspect ratio, and fidelity. Using the discussed measurement technologies makes it possible to choose an appropriate measurement method based on the structure type and research question. Additionally, this enables non-destructive measurement of NIL structures and their continued utilization in the NIL process. Consequently, new insights into the behavior of stamp materials during the imprinting process can be gained and the manufacturing process of diffractive elements can be optimized.

show abstract

Evaluation of filling behavior on UV nanoimprint lithography using release coating

Cited by 12 publications

References 5 publications

Lifetime amelioration of antireflection structure molds by means of partial-filling ultraviolet nanoimprint lithography

Lifetime amelioration of antireflection structure molds by means of partial-filling ultraviolet nanoimprint lithography

Filling Behavior Observation of UV-curable Resin Using Bridge-Structure Mold

Non-destructive multi-parameter investigation of nanoimprinted structures

Contact Info

Product

Resources

About