Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection

Ohyama, Masaki; Nimura, Masatsugu; Mizuno, Jun; Shoji, Shuichi; Nonaka, Takamasa; Shinba, Yoichi; Shigetou, Akitsu

doi:10.1016/j.microrel.2015.12.033

Cited by 10 publications

(6 citation statements)

References 23 publications

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“…The observed initial state of the 3DIC joints by various groups is very close to current simulations. [4,5,25,26] Additionally, the simulations with two different interlayer thicknesses, the same nucleation probability and kinetic parameters show a similar trend for the growth of interfacial IMCs. Consequently, we propose that the volume of solder microbump does not have much effect on the growth behavior of the IMCs despite what Dybkov's model [27] suggests, as it considers that the growth rate of IMCs in liquid solder during reflow is related to solder volume and the area of substrate which is in contact with the solder bump.…”

Section: Uncertainty In Initial Distribution Of the Imcsmentioning

confidence: 55%

“…(3) Early touch of one or two of the g-Cu 6 Sn 5 grains may yield to trap Sn in between the layers during the intermediate stages. (4) Eventually, for the systems where the mechanical reliability is more important than the uniformity in the current density, low duration reflow times may yield better conditions by avoiding the excessive growth and coarsening of the IMCs. Although excessive and multistage reflow process conditions seem to be inevitable.…”

Section: Resultsmentioning

confidence: 99%

“…Nowadays, the electronic industry is developing microbumps for 3DIC technology where the diameter of the microbump is about 10 to 20 lm and the expected dimension in the near future is around 1 lm. [1][2][3][4][5] The new interconnects required for 3DIC technologies bring the transient liquid phase bonding (TLPB) process to prominence once again. TLPB has its roots as a specialized joining technique in the electronics and aerospace industries.…”

Section: Introductionmentioning

confidence: 99%

“…[3,5] The micro packaging technology usually results in a sandwich interconnect structure in which, depending on the alloying system and the combination of solidification and aging treatments, intermetallics can nucleate and grow at the interfaces of the bond. [1][2][3][4][5][7][8][9] The time frame of bonding is highly dependent on the elements of alloying system and the treatment conditions. [6] In other words, the phase diagram together with the kinetic parameters and cost considerations [10] are the keys to select the proper components of the joint material.…”

Section: Introductionmentioning

confidence: 99%

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Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging

Attari

Arróyave

2016

J. Phase Equilib. Diffus.

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In this paper, a computational multi-phase field approach is utilized to study the formation of the Cu/Sn/Cu micro-joint in 3-Dimensional Integrated Circuits (3DICs). The method considers the evolution of the system during isothermal solidification at 250°C for the case of two different interlayer thicknesses (5 and 10 lm). The Cu/Sn/Cu interconnection structure is important for the micro packaging in the 3DIC systems. The thermodynamics and kinetics of growth of gCu 6 Sn 5 and e-Cu 3 Sn interfacial intermetallics (IMCs) are investigated by coupling the multiphase field method with CALPHAD approach. The interaction of the phases is addressed by assuming a metastable condition for the Cu/Sn reacting system. The simulations start with the nucleation and rapid growth of the g-Cu 6 Sn 5 IMCs at the initial stage, the nucleation and growth of e-Cu 3 Sn IMCs at the intermediate stage ending with the full consumption of Sn layer and the domination of e-Cu 3 Sn IMCs at the later stages. In addition, comparing different diffusion rates through the grain boundary of g phases show that their morphology is the direct consequence of balance of kinetic forces. This work provides a valuable understanding of the dominant mechanisms for mass transport in the Cu/Sn/Cu low volume interconnections. The results show that the phase field modeling is successful in addressing the morphological evolution and growth of IMC layers in the 3DIC joint formation.

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Section: Uncertainty In Initial Distribution Of the Imcsmentioning

confidence: 55%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging

Attari

Arróyave

2016

J. Phase Equilib. Diffus.

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“…Since the size of microbumps has been progressively scaled down, the remaining challenge is mainly in the ability of the microbumps to preserve their mechanical stability whilst maintaining their function. The requirement to utilize underfill is approached for mechanical stability, and to enhance joint strength between stacked chips and prevent microbump corrosion [ 60 ]. There are several methods of injecting underfill in the ultra-narrow gaps between the stacked chips.…”

Section: Three-dimensional Integrated Circuits: the Technologymentioning

confidence: 99%

Intermetallic compounds in 3D integrated circuits technology: a brief review

Annuar

Mahmoodian

Hamdi

et al. 2017

Science and Technology of Advanced Materials

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The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by through-Si-via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.

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Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration

Yao

Fan²,

Zhao

et al. 2017

J Mater Sci: Mater Electron

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Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection

Cited by 10 publications

References 23 publications

Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging

Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging

Intermetallic compounds in 3D integrated circuits technology: a brief review

Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration

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