2011
DOI: 10.1016/j.ijthermalsci.2011.02.002
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Evaluation of image reconstruction algorithms for non-destructive characterization of thermal interfaces

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Cited by 11 publications
(5 citation statements)
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“…[11, 18] proposed the thermal tomography method to reconstruct the thermal parameters of the targeted components. Erturk [19] presented thermal tomography for the non‐destructive characterisation of thermal interfaces by considering different image reconstruction algorithms. Shi et al.…”
Section: Introductionmentioning
confidence: 99%
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“…[11, 18] proposed the thermal tomography method to reconstruct the thermal parameters of the targeted components. Erturk [19] presented thermal tomography for the non‐destructive characterisation of thermal interfaces by considering different image reconstruction algorithms. Shi et al.…”
Section: Introductionmentioning
confidence: 99%
“…[11,18] proposed the thermal tomography method to reconstruct the thermal parameters of the targeted components. Erturk [19] presented thermal tomography for the non-destructive characterisation of thermal interfaces by considering different image reconstruction algorithms. Shi et al [10] proposed the use of the q-r characteristic curve to approximatively detect the heat intensity of female breast tissue to diagnose the degree of diseases.…”
Section: Introductionmentioning
confidence: 99%
“…Thermal tomography is an emerging non-destructive imaging technique which aims at recovery of three-dimensional images of the thermal conductivity and heat capacity of a physical body from non-invasive temperature measurements made on the surface of the body [1][2][3][4][5][6][7][8][9][10][11]. In the measurement process, the body is heated at a source location and temperature evolutions are measured at multiple measurement locations on the surface.…”
Section: Introductionmentioning
confidence: 99%
“…Thermal tomography has been studied with simulations in [1][2][3][4][5][6][7][8][9][10]. The spatially distributed thermal conductivity of a two-dimensional (2D) body was estimated using simulated steady state measurements in [1] and that of three-dimensional (3D) bodies with known heat capacities using simulated transient state measurements in [2,3]. The estimation of either the spatially distributed thermal conductivity or the spatially distributed heat capacity of a 2D body while the other parameter was assumed known was studied in [4].…”
Section: Introductionmentioning
confidence: 99%
“…An infrared microscopy technique to characterize a TIM layer through a silicon wafer was demonstrated by Hu et al [4]. Thermography techniques [5,6] may be used to characterize the transient thermal response of an interface, and thus infer the existence and location of voids. High-resolution methods, such as scanning electron microscopy [3], have also been applied to TIM layers.…”
Section: Introductionmentioning
confidence: 99%