2020
DOI: 10.1016/j.jmapro.2019.11.005
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Evaluation of microstructure and mechanical properties of transient liquid phase bonding of Inconel 718 and nano/ultrafine-grained 304L stainless steel

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Cited by 33 publications
(8 citation statements)
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“…The grain sizes of the solid solution here are notably smaller compared to those that eventually form towards the joint center as isothermal solidification proceeds. Similar findings were reported by Ghaderi et al, [9] who attributed this to boride formation in the region close to the base metal providing a barrier to grain growth. In this case it is presumed that the Ni-Ge-Nb phase similarly hindered grain growth.…”
Section: Isothermal Solidification Solid Homogenizationsupporting
confidence: 90%
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“…The grain sizes of the solid solution here are notably smaller compared to those that eventually form towards the joint center as isothermal solidification proceeds. Similar findings were reported by Ghaderi et al, [9] who attributed this to boride formation in the region close to the base metal providing a barrier to grain growth. In this case it is presumed that the Ni-Ge-Nb phase similarly hindered grain growth.…”
Section: Isothermal Solidification Solid Homogenizationsupporting
confidence: 90%
“…pct C 0 = 2.5 at. pct w = 65 lm (based on width following base metal dissolution) D = 6.22x10 À11 m 2 s À1 [9,40] Using Eq. [4], the expected time for IS to complete based only on B diffusion is approximately 30 minutes.…”
Section: ½4mentioning
confidence: 99%
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“…The result also confirms the presence of the higher amount of Si at ISZ, revealing the negligible amount of diffusion of Si from the filler material into the IN 718. This is attributed to the very low diffusivity of Si in Ni compared to B [37].…”
Section: Fesem and Eds Resultsmentioning
confidence: 99%
“…Samples were then wrapped in Kanthal wire that has a lower coefficient of thermal expansion than 316L and Zircaloy-4 so that pressure builds up during heating. Taking advantage of different coefficients of thermal expansion to generate pressure for diffusion bonding is not unusual [60][61][62] and can be complemented by clamp-like apparatuses that apply compression using screws [63][64][65][66][67]. If the sample geometry allows it, parts can also be press-fitted and put under pressure into a vacuum furnace where they are then diffusion bonded when the temperature is increased [68][69][70].…”
Section: Diffusion Bondingmentioning
confidence: 99%