Evaluation of nanoindentation load-depth curve of MEMS bridge structures by calculating the critical elastic-plastic bending deflections

Ma, Zhichao; Zhao, Hongwei; Du, Xijie; Zhou, Mingxing; Xiao-xi, MA; Liu, Changyi; Liu, Ren

doi:10.1016/j.apsusc.2017.10.106

Cited by 8 publications

(2 citation statements)

References 36 publications

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“…However, the main limitations of this technique are the indentation depth, complex distribution of the indentation induced stresses and relatively costly experimental setup. Generally, FEM (finite element method) based simulations and analytical models are used to study the experimental load versus indentation depth curve and corresponding elastic-plastic stress distribution in thin films [30][31][32][33][34][35][36][37][38]. In addition to static tests, non-destructive dynamic tests based on the resonance frequency have also be implemented to evaluate the elastic behavior and residual stress in the thin films [39][40][41].…”

Section: Introductionmentioning

confidence: 99%

Elastic–plastic characterization of microstructures through pull-in 4 point bending test

Somà¹,

Saleem²

2018

J. Micromech. Microeng.

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This paper presents a simple design of gold MEMS, with a central test specimen undergoing tensile loading, for the experimental characterization of elastic-plastic behavior using electrostatic actuation. A kinematic model for the test microstructures is presented that relates the experimentally measured deflection in the test specimen to the developed axial and bending stress. Moreover, an elastic-plastic beam bending model is presented to analyze the development of plastic hinges in the central test specimen. The design of test microstructures allows us to achieve stress values higher than the yield stress of the gold specimen before the pull-in effect, thus allowing to analyze the effect of elastic-plastic behavior on the static deflection profile of the central test specimen under repeated loading. The actuation voltagedeflection tests under repeated loading, both in the elastic and elastic-plastic region, allowed to estimate the applied stress limit for the onset of plasticity in gold thin film based MEMS devices.

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Section: Introductionmentioning

confidence: 99%

Elastic–plastic characterization of microstructures through pull-in 4 point bending test

Somà¹,

Saleem²

2018

J. Micromech. Microeng.

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“…They are widely used in medicine, military fields, and our daily life [1][2][3]. They have high requirements in parts, not only small size but also complex microstructures [4,5]. Microarrays play an important role in many key components [6,7].…”

Section: Introductionmentioning

confidence: 99%

Micro Electrochemical Machining of Array Micro-Grooves Using In-Situ Disk Electrode Fabricated by Micro-WEDM

Wang

Zhang

et al. 2020

Micromachines

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This paper develops an array micro-grooves manufacturing method using micro electrochemical machining (ECM) with disk electrode, which is prepared by in-situ micro wire electrical discharge machining (WEDM). This technology focuses on the difficulty of array structure manufacture in micro-electro-mechanical systems (MEMS). A micro-ECM system is built based on the micro-WEDM machine to achieve high precision processing of the array micro-grooves. Since micro-WEDM has good performance in high precision machining of the rotating structure, single and multi-edge disk electrodes can be fabricated in-situ using graphite. The as-prepared disk tool electrode is directly used for micro-electrochemical milling of the array micro-grooves without disassembling away from the device, which avoids the positioning error caused by the re-clamping of the disk electrode. With the advantages of high surface quality and no electrode loss, micro-ECM improves the manufacture performance of the micro-parts. Through wire path optimization, the shape accuracy of the disk edge is improved. After the research of the micro-ECM parameters, the process is improved, and finally, the high precision array micro-grooves are obtained. This method combines the advantages of micro-WEDM and disk electrode micro-ECM milling, and it is convenient for large-scale manufacture of array micro-structures on micro-parts and MEMS.

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Effective method to simultaneously release residual stress and promote planarization of surface indentation achieved by secondary indentation

Jiang

Zhao

et al. 2020

Applied Surface Science

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Evaluation of nanoindentation load-depth curve of MEMS bridge structures by calculating the critical elastic-plastic bending deflections

Cited by 8 publications

References 36 publications

Elastic–plastic characterization of microstructures through pull-in 4 point bending test

Elastic–plastic characterization of microstructures through pull-in 4 point bending test

Micro Electrochemical Machining of Array Micro-Grooves Using In-Situ Disk Electrode Fabricated by Micro-WEDM

Effective method to simultaneously release residual stress and promote planarization of surface indentation achieved by secondary indentation

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