Evaluation of oxide chemical mechanical polishing performance of polystyrene coated ceria hybrid abrasives

Chen, Ailian; Zhang, Zefang; Li, Xiazhang; Yang, Chen

doi:10.1007/s10854-015-4110-0

Cited by 9 publications

(2 citation statements)

References 23 publications

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“…Chen et al reported polymer based core-shell abrasive aiming to reduce scratch defect by CMP. The core abrasive is spherical polystyrene (PS) and ceria is selected as shell abrasive [49]. The mechanism of low scratch and minimize wafer damage is cushion effect of soft polymer core abrasive.…”

Section: Advanced Abrasives For Future Cmp Applicationsmentioning

confidence: 99%

Abrasive for Chemical Mechanical Polishing

Kim¹

2018

Abrasive Technology - Characteristics and Applications

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Chemical mechanical polishing (CMP) is one of the most essential processes in semiconductor manufacturing. Its importance becomes highly underscored at the advanced device toward sub 14 nm scaling. The fundamental mechanism of CMP is to create soften surface layer by chemical reaction and then, mechanical force by abrasive particles remove soften layer. The role of CMP is not only material removal, but also planarization, surface smoothening, uniformity control, defect reduction and more. Moreover, semiconductor yield enhancement is sensitively influenced by CMP processing. Surface scratching, which is generated by CMP in nature, is considered as 'killer defect' in semiconductor manufacturing. Hence, to achieve proper CMP performance without surface scratching, understanding and development of abrasive particles are crucially important. In this chapter, CMP fundamentals, applications and challenges associated with abrasive particle technology including synthesis (up to nanoparticle scale), tribochemical reaction, abrasive surface zeta potential behavior, particle size and its distribution will be discussed.

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Section: Advanced Abrasives For Future Cmp Applicationsmentioning

confidence: 99%

Abrasive for Chemical Mechanical Polishing

Kim¹

2018

Abrasive Technology - Characteristics and Applications

View full text Add to dashboard Cite

show abstract

“…Particularly, the types of surface defects aer polishing were classied and quantied by using a confocal review station. Our group focused on the synthesis of the composites containing polymer (polystyrene (PS) or polymethylmethacrylate) cores and ceria shells, 10,11 and their applications in oxide-CMP. For porous abrasives, Chen and coworkers 12 investigated the CMP effects of various porous abrasives such as a-alumina and alumina/ceria composites on Al-NiP hard disk substrate.…”

Section: Introductionmentioning

confidence: 99%