Evaluation of repeated single-point diamond turning on the deformation behavior of monocrystalline silicon via molecular dynamic simulations

Influence of laser nanostructured diamond tools on the cutting behavior of silicon by molecular dynamics simulation

“…[24][25][26][27] To reduce computational costs in this study, the cutting velocity used was 200 m s À1 , which is much larger than the real velocity of cutting. However, based on previous work, 15,23,26,[28][29][30][31][32][33][34] MD simulations nished with a relatively high cutting speed can successfully produce key insights into the cutting process. All simulations were performed using open-source Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) soware.…”

Mechanical properties of silicon in subsurface damage layer from nano-grinding studied by atomistic simulation

“…For the crystal structure, the radial distribution function has a sharp peak due to its ordered structure, and for an amorphous material, the radial distribution function generally has only a blunt peak. 29 RDFs of the silicon workpiece before and during grinding processes for different grinding distances with grinding speed of 150 m/s are illustrated in Fig. 6.…”

Influence of Abrasive Shape on the Abrasion and Phase Transformation of Monocrystalline Silicon

“…Fang et al have established the criterion of movement pattern of particle to quantify the correlation between theoretical and experimental studies [18,25,[36][37][38][39], which was described by the following formulas and shown in supplementary material: e h μ ≥ (for sliding particle) (2) e h μ < (for rolling particle) (3) where…”

“…Monocrystalline silicon (Si), as the key component of micro-electro-mechanical systems (MEMS), has been broadly investigated, recently [1][2][3]. It is worthy to note that the mechanical characteristics of silicon, especially the relatively poor friction and wear behaviors, severely limit the working stability of MEMS [4,5].…”