“…For instance, SiO 2 encapsulation is frequently used with popular PCM like PEG2000 and PEG4000 [ 25 , 38 , 41 , 42 ]. Additionally, there are less commonly used strategies, such as adsorption on diatomite silica microporous structures [ 62 , 64 ], the use of PCM in composite form [ 38 , 58 ], polymerisation [ 31 , 77 , 78 ], emulsion polymerisation [ 52 ], and integration with multi-walled carbon nanotubes (MWCNT) [ 45 ], along with more advanced techniques like microencapsulation [ 79 ] and shape-stabilised expanded graphite [ 26 , 80 ]. Carrier matrix materials can also influence the thermal properties of PCM under various conditions (as shown in Table A1 ).…”