scale strategy for high-k/metal-gate UTBB-FDSOI devices modeling with emphasis on back bias impact on mobility. Journal of Computational Electronics, Springer Verlag, 2013, 12, pp.675-684. 10.1007 Multi-scale analysis of the mobility in high-k UTBB-FDSOI Devices and comparison to split-CV measurements.
Abstract-A rigorous study of the mobility in high-k metal gate Ultra-Thin Body and Box Fully Depleted SOI (UTBB-FDSOI) devices is done by means of split C-V measurements and advanced simulations. Measurements have been performed for various Interfacial Layer (IL)Equivalent Oxide Thickness (EOT) allowing an investigation of the physical mechanisms responsible for the mobility degradation at high-k/IL interface. The impact of the back bias on transport properties is investigated and mobility enhancement in the forward regime (back gate inversion) is demonstrated. A multi-scale simulation approach is performed and we compared simulated mobility using quantum Non-Equilibrium Green's Functions (NEGF) to semi-classical solvers results using the Kubo Greenwood (KG) approach. We demonstrated good correlations between these solvers comparing phonon and remote Coulomb-limited mobility. However, a clear overestimation of the surface roughnesslimited mobility determined using semi-classical solvers is shown compared to NEGF results. These advanced solvers have been used to reproduce mobility measurements allowing us to calibrate Technology computer aided design (TCAD) mobility models.