Evaluation of the quality of composite diamond-containing materials by their electrical and thermal conductivity

Новіков, М. В.; Maistrenko, A. L.; Кущ, В. І.; Ivanov, S. A.

doi:10.1007/s11003-006-0063-z

Cited by 2 publications

(3 citation statements)

References 5 publications

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“…Electrical resistivity is constant below 850 K -a feature which might arise from electron scattering from a complex microstructure and magnetic clusters -, while it increases linearly with temperature above 850 K. The low carriers' concentration (10 19 -10 21 cm -3 between 4-300 K), decreasing with temperature, and the high lattice distortion typical for HEAs support the hypothesis of electrical resistivity being affected by phonon scattering above the Debye temperature of the alloy. Electrical resistivity of the nano-diamond composite shows the opposite trend and decreases very steeply between 300 and 400 K[33]. The specimen behaves like a semiconductor, a feature which has not been observed for diamondcontaining MMCs before.…”

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confidence: 69%

A novel High-Entropy Alloy-based composite material

Riva

Tudball

Mehraban

et al. 2018

Journal of Alloys and Compounds

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This study reports the results of the addition of different reinforcing agents (i.e. nano-diamonds, SiC, Sc 2 O 3 , h-BN, c-BN and CN) on the sintering process of the B2-structured Al 2 CoCrFeNi High-Entropy Alloy. The best candidate for further thermal, electrical and mechanical characterisation was chosen to be the alloy containing 2 wt.% nano-diamonds. The composite was prepared using spark-plasma sintering of pre-alloyed powders and characterized with SEM-EDX, DSC, Laser Flash Analysis (LFA), electrical conductivity and Seebeck coefficient, dilatometry, Young's modulus, Vicker's hardness, 3-points flexural test. It shows unexpectedly low thermal expansion coefficient (from 3×10-6 to 17×10-6 K-1 between RT and 500 °C), high electrical resistivity and Seebeck coefficient and hardness comparable to the sintered blank Al 2 CoCrFeNi.

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confidence: 69%

A novel High-Entropy Alloy-based composite material

Riva

Tudball

Mehraban

et al. 2018

Journal of Alloys and Compounds

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“…A direct mutual interrelation of the degrees of a thermal and mechanical contacts of phases takes place [8,15], as both are defined by the same physicochemical processes at the interface. This situation is the key one in the use of the thermal conductivity as a performance criterion in the procedure of nondestructive express diag nostics of sintered CDM samples proposed in [16,17]. The present work in addition to other things, is the next step to a practical implementation of the above procedure.…”

Section: T H Q C Nmentioning

confidence: 90%

“…As one of the possible applications, we indi cate the express methods to assess the CDM quality by the thermal and electric conductivities proposed in [16,17]. The thermal conductivity is a very structure sensitive magnitude and the ratio of the experimental value to calculated one for a defect free composite may act as an index of the composite quality.…”

Section: Effect Of the Thermal Contact Resistance On The Diamond Grainmentioning

confidence: 99%

Effect of the contact conductivity of the diamond–metal binder interface on the thermal conductivity of diamond-containing composites

Shmegera

Podoba

Кущ

et al. 2015

J. Superhard Mater.

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The effect has been studied of the contact conductivity of the diamond-metal binder interface on the thermal conductivity of diamond containing composites having two and three component nickel based metal binders. A device and procedure have been developed for measuring the thermal conductivity coefficients of binders and based on them diamond containing composites. The dependence of the ther mal conductivity coefficients on the compositions (particularly, the presence of the carbide forming addi tives) and structures has been analyzed. A theoretical model of the composite has been proposed, which allows for the real shape of a diamond crystal and contact conductivity of its faces. The estimation of the thermal contact conductivity of the interface has been derived by solving the inverse problem. It agrees sat isfactory with the literature data on direct physical studies and similar estimates for composites with alu minum and copper binders. The influence of the contact resistance on the temperature mode of the dia mond tool operation has been indicated by the results of modeling.

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Evaluation of the quality of composite diamond-containing materials by their electrical and thermal conductivity

Cited by 2 publications

References 5 publications

A novel High-Entropy Alloy-based composite material

A novel High-Entropy Alloy-based composite material

Effect of the contact conductivity of the diamond–metal binder interface on the thermal conductivity of diamond-containing composites

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