“…Presently, SiP and SoP have been effectively fulfilled using various advanced packaging technologies in a two-dimensional (2D) planar, two-and-a-half dimensional (2.5D) [3,4], or three-dimensional (3D) IC packaging configuration [5], such as package-in-package (PiP) [4], package-on-package (PoP) [6,7] using flip chip chip-scale packaging (FCCSP) [8,9], and flip chip ball grid array (FCBGA) packaging [10], and 3D IC integration with through silicon vias (TSVs) silicon or glass interposers [3,4,11,12]. When fulfilling these HI packaging technologies, high-density interconnect (HDI) IC substrates and interposers play a crucial role in providing electrical connection between the IC chip and the printed circuit board (PCB) and mechanical support and heat dissipation for IC chips.…”