2021
DOI: 10.1109/tcpmt.2021.3065958
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Evaluation of the Quality of BGA Solder Balls in FCBGA Packages Subjected to Thermal Cycling Reliability Test Using Laser Ultrasonic Inspection Technique

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Cited by 10 publications
(5 citation statements)
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“…Post-processing analyses of SAW data has involved the use of signal processing methods such as local temporal coherence analysis [45], wavelet analysis [46], spectral analysis [47] in the frequency domain, and correlation coefficient analysis [48][49][50][51][52][53][54][55] in the time domain. Infrared thermography thermal images and transient temperature response have also been used to analyze heat conduction for defect detection in [56][57][58][59][60][61][62][63].…”
Section: Other Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…Post-processing analyses of SAW data has involved the use of signal processing methods such as local temporal coherence analysis [45], wavelet analysis [46], spectral analysis [47] in the frequency domain, and correlation coefficient analysis [48][49][50][51][52][53][54][55] in the time domain. Infrared thermography thermal images and transient temperature response have also been used to analyze heat conduction for defect detection in [56][57][58][59][60][61][62][63].…”
Section: Other Methodsmentioning
confidence: 99%
“…SAW has been used to identify defects such as missing bumps and cracks in [45][46][47][48][49]50], voids in micro solder bumps in [54,55], underfills in [49], ball interconnections in flip chips and BGA in [51][52][53].…”
Section: Surface Acoustic Waves (Saw)mentioning
confidence: 99%
“…Dye and pull tests were held on all samples and BGA components to observe potential solder joint cracks indicators for rework and adjacent BGA components 31 . Initial optical and X-ray inspections were performed on the PCBA samples to determine signs of physical damage or stress on the reworked and adjacent components.…”
Section: Methodsmentioning
confidence: 99%
“…Presently, SiP and SoP have been effectively fulfilled using various advanced packaging technologies in a two-dimensional (2D) planar, two-and-a-half dimensional (2.5D) [3,4], or three-dimensional (3D) IC packaging configuration [5], such as package-in-package (PiP) [4], package-on-package (PoP) [6,7] using flip chip chip-scale packaging (FCCSP) [8,9], and flip chip ball grid array (FCBGA) packaging [10], and 3D IC integration with through silicon vias (TSVs) silicon or glass interposers [3,4,11,12]. When fulfilling these HI packaging technologies, high-density interconnect (HDI) IC substrates and interposers play a crucial role in providing electrical connection between the IC chip and the printed circuit board (PCB) and mechanical support and heat dissipation for IC chips.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, they play a dominant and essential role in the thermomechanical behavior of the electronic assemblies, driven by the mismatch between temperature and the coefficient of thermal expansion (CTE) among the constituent materials. Presently, many studies have been carried out to assess the thermal performance, reliability, and warpage of various laminate substrate-based IC packages and assemblies (see, e.g., [1][2][3][4]7,9,10,13]). Normally, this can be achieved using direct detailed finite element analysis (DD-FEA).…”
Section: Introductionmentioning
confidence: 99%