Evaluation of thermal deformation model for BGA packages using moiré interferometry

Joo, Jinho; Cho, Seungmin

doi:10.1007/bf03184732

Cited by 3 publications

(2 citation statements)

References 9 publications

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“…They were employed to study the temperature-dependent thermo-mechanical behavior. The schemes were implemented with convectiontype or conduction-type environmental chambers that provide the temperature control required in accelerated thermal cycling (isothermal loading) [35,41,[50][51][52][53][54][55][56][57][58][59][60][61][62][63][64][65]. Park et al…”

Section: Microelectronics Devicementioning

confidence: 99%

Recent Applications of Moiré Interferometry

Ifju

Han

2010

Exp Mech

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Moiré interferometry has been a valuable experimental technique for the understanding of the mechanical behavior of materials and structures. Over the last decade less emphasis has been placed on the development of the technique and more towards applications. This paper is a review article on recent applications using moiré interferometry in the fields of microelectronics devices, material characterization, micromechanics, residual stress, composite materials, fracture mechanics, and biomechanics. The general principles of moiré interferometry and advancement of techniques will not be discussed in this text, but references will be provided.

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Section: Microelectronics Devicementioning

confidence: 99%

Recent Applications of Moiré Interferometry

Ifju

Han

2010

Exp Mech

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“…The Moiré interferometry method has the advantages of very high precision and the ability to measure the deformation of the whole field in a noncontact manner and is not significantly affected by the surrounding environment, such as vibration and light. Owing to these advantages, the Moiré interferometry method has recently been effectively used in thermal deformation analysis of small electronic components [5][6][7][8][9][10][11][12][13][14]. The application of this method has also been extended to mechanical bending analysis and thermal strain analysis of electronic packages [15,16].…”

Section: Introductionmentioning

confidence: 99%

Deformation behaviors of flip chip plastic ball grid array packages subjected to temperature change using moiré interferometry

Kim

Joo

2023

Materialwissenschaft Werkst

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When the temperature of the package assembly is changed, non‐uniform deformation and local stress may occur owing to the different thermal expansion coefficients of the constituent materials, while concentrated thermal stress may cause significant failure. In this study, we carry out an experiment and analysis of the thermal deformation of a flip chip plastic ball grid array package with respect to temperature change. Interference fringe patterns representing the displacement distribution of each temperature stage are obtained using a Moiré interferometry and the bending deformation behavior and the strain of the solder ball are analyzed thereafter. We compare the deformation behavior of a single‐sided package assembly and a double‐sided package assembly. The effective strain, which significantly affects the failure of the solder ball, is found to be the largest in the solder ball just outside the edge of the chip in the case of the single‐sided package assembly. In the case of the double‐sided package assembly, the maximum effective strain is found in the solder ball just inside the edge of the chip, with a value approximately 50 % larger than in the case of the single‐sided package assembly.

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The Effect of Finite Element Models in Thermal Analysis of Electronic Packages

Choi¹,

Joo

2009

Transactions of the Korean Society of Mechanical Engineers A

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The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using moiré interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by moiré inteferometry.

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Evaluation of thermal deformation model for BGA packages using moiré interferometry

Cited by 3 publications

References 9 publications

Recent Applications of Moiré Interferometry

Recent Applications of Moiré Interferometry

Deformation behaviors of flip chip plastic ball grid array packages subjected to temperature change using moiré interferometry

The Effect of Finite Element Models in Thermal Analysis of Electronic Packages

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