Evaporation dynamics of water droplets on superhydrophobic nanograss surfaces

Aldhaleai, Ahmed; Khan, Faheem; Thundat, Thomas; Tsai, Peichun Amy

doi:10.1016/j.ijheatmasstransfer.2020.120149

Cited by 29 publications

(21 citation statements)

References 94 publications

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“…Superhydrophobic surfaces with different morphological structures exhibit different contact angle hysteresis, and the contact angle hysteresis affects the dynamic wetting performance of superhydrophobic surfaces. Many researchers have found evaporation studies to be a practical means of studying the dynamic wetting phenomenon (Fernandes et al 2015;Zhang et al 2016;Aldhaleai et al 2020;Han et al 2020). In this section, the evaporation behavior of a sessile water droplet Fig.…”

Section: Synergistic Effects Between Water Vapor-barrier Performance ...mentioning

confidence: 99%

Superhydrophobic surfaces with dual-scale roughness and water vapor-barrier property for sustainable liquid packaging applications

Zhang

Zhang²,

Cui³

et al. 2022

Cellulose

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There is an ongoing unmet global need to manufacture novel sustainable liquid packaging materials, that are not based on plastic film or aluminum foil. Superhydrophobic coating technologies have been proposed for developing more sustainable packaging materials. In this study, the underlying engineering principles for fabricating superhydrophobic surfaces proposed for liquid packaging are investigated, including but not limited to the substrates used and engineering properties of the surfaces. Specifically, to improve the engineering performance of superhydrophobic paper for use in packaging, the feasibility of combining platy montmorillonite (MMT, for its barrier properties) and nano-rolling-pin-shaped precipitated calcium carbonate (PCC, for its superhydrophobicity) into multifunctional coating layers is investigated. Water droplet evaporation experiments are performed to identify how subtle changes in the morphological structures of as-prepared superhydrophobic paper samples can produce a useful roughness structure for packaging applications. Paperboard, which is widely utilized in packaging, is chosen as a substrate to study the challenges of fabricating superhydrophobic paperboards for use in packaging. The results of this study provide engineering principles for using sustainable paper-based materials with a dual-scale roughness structure and barrier properties in liquid packaging applications. Graphical abstract

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Section: Synergistic Effects Between Water Vapor-barrier Performance ...mentioning

confidence: 99%

Superhydrophobic surfaces with dual-scale roughness and water vapor-barrier property for sustainable liquid packaging applications

Zhang

Zhang²,

Cui³

et al. 2022

Cellulose

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“…However, when the diffusion-driven model was employed for analyzing sessile droplet evaporation on non-wetting surfaces with microstructures [22] , especially on heated superhydrophobic surfaces, an overestimation of the evaporation rate was observed by Garimalla [ 23 , 24 ], Aldhaleai [25] and Bussonniere [26] . This deviation from the analytically predicted evaporation rate should result from evaporative cooling, giving rise to a temperature reduction on the liquid-vapor interface, which is in contradiction to the pivotal assumption made in the classical diffusion-driven model that the temperature of the droplet surface is constant and the same as the substrate temperature [17][18][19] .…”

Section: Introductionmentioning

confidence: 99%

Droplet Evaporation on Hot Micro-Structured Superhydrophobic Surfaces: Analysis of Evaporation from Droplet Cap and Base Surfaces

Huang

Liu

et al. 2022

International Journal of Heat and Mass Transfer

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“…The fabrication of superhydrophobic surfaces includes building rough structures and reducing surface energy. , Many approaches have adjusted the surface roughness by constructing array micro or nanostructures, and these surfaces are regular and controllable . The apparent contact angle will change if the size and the shape of the microstructures are adjusted .…”

Section: Introductionmentioning

confidence: 99%

Numerical Calculation of Apparent Contact Angles on the Hierarchical Surface with Array Microstructures by Wire Electrical Discharge Machining

Wang

Chi

et al. 2021

Langmuir

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It is necessary to theoretically research wettability in superhydrophobic surface fabrication. Here, a numerical calculation approach is proposed for determining the contact angle of the water droplets on array micropillars by wire electrical discharge machining (WEDM). A hierarchical model is employed for these array microstructures, including mechanical analysis for a water droplet placed on a smooth array and wettability evaluation on the morphology of the WEDM surface. On pillars, equations are listed to solve the apparent contact angle according to force balance of gravity, tension, and pressure. As for the WEDM morphology, temperature simulation and measurement are carried out, and then the effect of roughness on surface wettability is studied. Constructed formulas predict the contact angle, and then the effect of geometric dimensions is obtained. In order to verify the assumption, array micropillars with different cross-profiles are prepared using high-speed WEDM on the Al alloy surface. Through the results of contact angle determination, the numerical calculation is carried out. This theoretical prediction is beneficial for improving the fabrication of the superhydrophobic surface by WEDM.

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Evaporation dynamics of water droplets on superhydrophobic nanograss surfaces

Cited by 29 publications

References 94 publications

Superhydrophobic surfaces with dual-scale roughness and water vapor-barrier property for sustainable liquid packaging applications

Superhydrophobic surfaces with dual-scale roughness and water vapor-barrier property for sustainable liquid packaging applications

Droplet Evaporation on Hot Micro-Structured Superhydrophobic Surfaces: Analysis of Evaporation from Droplet Cap and Base Surfaces

Numerical Calculation of Apparent Contact Angles on the Hierarchical Surface with Array Microstructures by Wire Electrical Discharge Machining

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