Evaporation factor in productivity increase of hot target magnetron sputtering systems

Bleykher, G.A.; Borduleva, Alena Olegovna; Кривобоков, В. П.; Sidelev, Dmitrii V.

doi:10.1016/j.vacuum.2016.07.030

Cited by 39 publications

(19 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Our previous studies show that this value is almost the same as the power density of the ion flux bombarding the surface of the target, i.e. W ion [14]. The variation of W ion in time is defined by the power oscillogram of the magnetron energy supply.…”

Section: No /mentioning

confidence: 93%

Magnetron Sputtering With Hot Solid Target: Thermal Processes and Erosion

Borduleva¹,

Bleykher²,

Sidelev³

et al. 2016

Acta Polytech

View full text Add to dashboard Cite

Abstract. This work focuses on erosion and thermal processes taking place on the surface of the titanium target in magnetron sputtering. The study was carried out using magnetron sputtering systems (MSS) with different thermal insulation target types from the magnetron body. It was found that the presence of an evaporation component allows the rate of removal of atoms from the surface of a solid target to be increased with limited thermal conduction. A mathematical simulation was used to evaluate the contribution of evaporation to the increase in the coating deposition rate for complete and partial thermal insulation.It was found that non-uniformity of the direct-axis component of the magnetic induction vector helps to localize the heating. also increases the evaporation rate on the surface of the target. It was proved that local evaporation including sublimations on the surface of a hot target is a significant factor in increasing the coating deposition rate. Due to this mechanism, the coating deposition rate can be increased 5 times for Ti in comparison with fully cooled targets. This result can be applied for direct current magnetrons and also for pulsed systems. It was also found that evaporation increased the energy efficiency of the target erosion. The most suitable metals were selected for obtaining high-intensity emission of atoms from a solid target.

show abstract

Section: No /mentioning

confidence: 93%

Magnetron Sputtering With Hot Solid Target: Thermal Processes and Erosion

Borduleva¹,

Bleykher²,

Sidelev³

et al. 2016

Acta Polytech

View full text Add to dashboard Cite

show abstract

“…Нагрев вызывается воздействием ионного потока, бомбардирующего мишень при магнетронном распылении. Схожий эффект описан в [51]. Для его реализации в случае металлических мишеней поток тепла уменьшают, изолируя их от охлаждаемых магнитов магнетронной системы.…”

Section: обсуждение результатовunclassified

Структурные Свойства Тонких Пленок, Полученных Магнетронным Распылением Полидиацетилена

Стрелецкий¹,

Завидовский²,

Нищак³

et al. 2020

Физика Твердого Тела

View full text Add to dashboard Cite

In the work we studied films synthesized by RF-sputtering of monocrystalline polydiacetylene (PDA). Investigations of the structure were carried out by Raman spectroscopy, transmission electron microscopy, X-ray photoelectron spectroscopy. We showed that obtained films had heterogeneous structure containing nanoscaled inclusions of initial PDA and irregularly distributed sp/sp2 fragments of carbon chains.

show abstract

“…13 ∼1.4 W/cm 2 (pulsed discharge) 0.5 Pa (∼10 sccm) Posadowski (WMK-50) 14 ≤ 300 W/cm 2 (pulsed discharge) ∼0.25 Pa Bleykher et.al. 15 1-8 W/cm 2 (period averaged value, pulsed discharge) 0. power density of the M3C is sufficiently low compared with previous film production studies using DC discharges. [10][11][12] In general, pulsed discharge techniques are useful for low gas pressure operation of less than 0.5 Pa. [13][14][15] Plasma confinement by a magnetic mirror enables DC sputtering with low power density, in spite of low gas pressure of less than 0.5 Pa. Figure 3 shows the dependence of the plasma discharge light emission pattern on p Ar and P DC .…”

Section: Power Densitymentioning

confidence: 99%

“…15 1-8 W/cm 2 (period averaged value, pulsed discharge) 0. power density of the M3C is sufficiently low compared with previous film production studies using DC discharges. [10][11][12] In general, pulsed discharge techniques are useful for low gas pressure operation of less than 0.5 Pa. [13][14][15] Plasma confinement by a magnetic mirror enables DC sputtering with low power density, in spite of low gas pressure of less than 0.5 Pa. Figure 3 shows the dependence of the plasma discharge light emission pattern on p Ar and P DC . Low power density operation of 0.25 W/cm 2 was confirmed under experimental conditions of p Ar = 0.26 Pa and P DC = 5 W. Although the emission intensity increases with the increasing p Ar , the doughnut-shaped plasma discharge region narrows.…”

Section: Power Densitymentioning

confidence: 99%

Magnetron sputtering cathode for low power density operation

Motomura

Tabaru

2017

AIP Advances

View full text Add to dashboard Cite

A novel magnetron sputtering cathode with a magnetic mirror configuration is proposed, for low power density operation. The magnetic field profiles are simply constructed using two cylindrical permanent magnets positioned behind the disk-shaped sputtering target of 50 mm in diameter. The magnetic mirror configuration near the center and the outer edges of the target enables low power density operation up to 0.25 W/cm 2 in the case of DC input power of 5 W. A sputtering rate of ∼0.2 nm/min was obtained under experimental conditions with target-substrate distance of 280 mm, Ar gas pressure of 0.1 Pa, and DC input power of 15 W.

show abstract

Evaporation factor in productivity increase of hot target magnetron sputtering systems

Cited by 39 publications

References 17 publications

Magnetron Sputtering With Hot Solid Target: Thermal Processes and Erosion

Magnetron Sputtering With Hot Solid Target: Thermal Processes and Erosion

Структурные Свойства Тонких Пленок, Полученных Магнетронным Распылением Полидиацетилена

Magnetron sputtering cathode for low power density operation

Contact Info

Product

Resources

About