Properties of Ge
oxides are significantly different from those
of widely used Si oxides. For example, the instability of GeO
x
at device junctions causes electronic defect
levels that degrade the performance of Ge-containing devices (e.g.,
transistors and infrared detectors). Therefore, the passivating Si
layers have been commonly used at Ge interfaces to reduce the effects
of Ge oxide instability and mimic the successful strategy of Si oxidation.
To contribute to the atomic-scale knowledge and control of oxidation
of such Si-alloyed Ge interfaces (O/Si/Ge), we present a synchrotron
radiation core-level study of O/Si/Ge, which is combined with scanning
probe microscopy measurements. The oxidation processes and electronic
properties of O/Si/Ge(100) are examined as functions of Si amount
and oxidation doses. In particular, the incorporation of Si into Ge
is shown to cause the strengthening of Ge–O bonds and the increase
of incorporated oxygen amount in oxide/Ge junctions, supporting that
the method is useful to decrease the defect-level densities.