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NiAl nanoparticles possess high-energy density and good mechanical properties at elevated temperatures, and are considered as an important material. However, the differences in the diffusion behavior of Al adsorbed atoms on different Ni substrate surfaces and the effects of different diffusion mechanisms on the deposition growth of Al atoms on the Ni substrate surface are highly desired to be clarified. Therefore, in the present work, the diffusion behavior of single Al adsorbed atoms and nanoparticle cluster growth on the Ni substrate surface of decahedral (DEC), cuboctahedral(CUB) and icosahedral(ICO) structures are systematically studied by molecular dynamics (MD) throuh analyzing the embedded atom potentialand using the nudged elastic band method. The diffusion barriers of Al adsorbed atoms on three different Ni substrates are calculated by nudged elastic band methodand analyzed, showing that the diffusion barrier is greatly affected by the smoothness of the step edge and the atomic coordination number of substrate as well. The diffusions of Al adsorption atoms on the surfaces of three Ni substrates are realized by two mechanisms, namely exchanging or hoping, and the lowest Ehrlich-Schwoebel (ES) barrier is 0.38 eV for exchange CUB{111} → {100}, 0.52 eV for exchange DEC{111} → {100}, and 0.52 eV for hoping ICO {111} → {111}. The exchanging mechanismsupports Al adatoms diffusing from {111} to {100} facet on the three Ni substrates, while the diffusion between two adjacent {111} facets is mainly driven by the hoping mechanism. On this basis, atom-by-atom growth MD simulation is used to study the structure of the Ni-Al cluster. The deposited Al atoms first tend to diffuse near the edges of the steps and the vertices. The deposited Al atoms begin to aggregate into islands with the increase of their number. For Al atoms on the Ni cluster, a good Ni-core/Al-shell structure can be obtained by depositing Al atoms on the surface of Ni substrate at lower temperatures. In this core-shell structure, Al atoms have a larger surface energy and atom radius compared with Ni atoms. For the ICO substrate, the corresponding defect number of core-shell clusters is smaller than for the CUB and the DEC substrate, which is in good agreement with the diffusion behavior of Al adsorbed atoms on the Ni substrate cluster surface. The surface of Ni-Al bimetal is gradually alloyed with the increase of growth temperature. This study provides a good insight into the diffusion and growth of Al adsorbed atoms on Ni substrates surface on an atomic scale.
NiAl nanoparticles possess high-energy density and good mechanical properties at elevated temperatures, and are considered as an important material. However, the differences in the diffusion behavior of Al adsorbed atoms on different Ni substrate surfaces and the effects of different diffusion mechanisms on the deposition growth of Al atoms on the Ni substrate surface are highly desired to be clarified. Therefore, in the present work, the diffusion behavior of single Al adsorbed atoms and nanoparticle cluster growth on the Ni substrate surface of decahedral (DEC), cuboctahedral(CUB) and icosahedral(ICO) structures are systematically studied by molecular dynamics (MD) throuh analyzing the embedded atom potentialand using the nudged elastic band method. The diffusion barriers of Al adsorbed atoms on three different Ni substrates are calculated by nudged elastic band methodand analyzed, showing that the diffusion barrier is greatly affected by the smoothness of the step edge and the atomic coordination number of substrate as well. The diffusions of Al adsorption atoms on the surfaces of three Ni substrates are realized by two mechanisms, namely exchanging or hoping, and the lowest Ehrlich-Schwoebel (ES) barrier is 0.38 eV for exchange CUB{111} → {100}, 0.52 eV for exchange DEC{111} → {100}, and 0.52 eV for hoping ICO {111} → {111}. The exchanging mechanismsupports Al adatoms diffusing from {111} to {100} facet on the three Ni substrates, while the diffusion between two adjacent {111} facets is mainly driven by the hoping mechanism. On this basis, atom-by-atom growth MD simulation is used to study the structure of the Ni-Al cluster. The deposited Al atoms first tend to diffuse near the edges of the steps and the vertices. The deposited Al atoms begin to aggregate into islands with the increase of their number. For Al atoms on the Ni cluster, a good Ni-core/Al-shell structure can be obtained by depositing Al atoms on the surface of Ni substrate at lower temperatures. In this core-shell structure, Al atoms have a larger surface energy and atom radius compared with Ni atoms. For the ICO substrate, the corresponding defect number of core-shell clusters is smaller than for the CUB and the DEC substrate, which is in good agreement with the diffusion behavior of Al adsorbed atoms on the Ni substrate cluster surface. The surface of Ni-Al bimetal is gradually alloyed with the increase of growth temperature. This study provides a good insight into the diffusion and growth of Al adsorbed atoms on Ni substrates surface on an atomic scale.
Bimetallic core-shell nanoparticles such as NiCu are of great interest not only due to their excellent stability, selectivity, and magnetic and catalytic properties, but also because they are tunable by changing the morphology, surface element distribution, and particle size of the nanoparticles. The surface segregation and structural features of NiCu bimetallic nanoparticles, the deposition growth and the surface diffusion of Cu adsorbed atoms on the Ni substrate surface are studied by using molecular dynamics and the Montero method combined with embedded atomic potential. The results show that the Cu atom has a strong tendency of surface segregation. With the increase of concentration of Cu atoms, Cu atoms preferentially occupy the vertex, edge, (100), and (111) facet of nanoparticles due to the difference in configuration energy between Cu atoms and surface Ni atoms with different coordination numbers after the exchange, and finally form perfect Ni-core/Cu-shell nanoparticles. When growth temperature <i>T</i> = 400 K, the Ni-core/Cu-shell structure formed is the most stable. By observing the NiCu core-shell structure’s growth sequence, it is found that a few Ni atoms are replaced by Cu atoms on the step edge of the Ni substrate. The diffusion energy barrier of Cu atoms adsorbed on a Ni substrate surface is calculated by using the nudged elastic band method. The results show that Cu atoms adsorbed need to overcome a large ES barrier for both exchange and diffusion, making it difficult to diffuse between the facets of Ni substrate surface in a temperature range of 200–800 K. The lowest energy barrier for the diffusion of Cu atoms between facets of Ni substrate surface is 0.43 eV, and the diffusion path is from (111) facet to (100) facet. In contrast to Ni substrate, Ni atoms deposited on Cu substrate can easily migrate from the (111) facet to the (100) facet with a diffusion energy barrier of only about 0.12 eV, and at the present simulated temperature, Ni adsorbed atoms are unable to migrate on the (100) facet, resulting in a growth configuration toward an octahedral shape with its eight apex angles almost occupied by Ni atoms. In this paper, a new idea and method are provided for the preliminary design of NiCu nano-catalysts from atoms.
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