Evolution of Ag3Sn at Sn–3.0Ag–0.3Cu–0.05Cr/Cu joint interfaces during thermal aging

Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn–1Ag–0.5Cu solder alloys

“…The as-cast microstructure of SAC105 solder alloy possesses Ag 3 Sn particles in the size range of approximately 0.11-0.72 lm, as shown in [15,21,24]. Since, the diffusion of Ag atoms in Sn increases during aging [12,26], the Ag solute atoms migrate from the Sn matrix surrounding the smaller Ag 3 Sn particles and diffuse into the Sn matrix toward the Sn matrix surrounding the larger Ag 3 Sn particles based on the above-mentioned Gibbs-Thomson effect. This migration of Ag solute atoms causes an increase in the vacancy diffusion rate of the Ag 3 Sn particles.…”

In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

“…Much work has been done on the formation and growth of IMC under different conditions for lead-free solder joints [2][3][4]. However, for Sn-Ag solder system when the silver content in is close to or more than eutectic composition, bulk Ag 3 Sn IMC plates are easily formed in the solder matrix or at the interfaces [5][6][7], which degrades the mechanical properties of solder joints [8][9][10]. And therefore, for Sn-Ag lead-free solder system, the size and distribution of Ag 3 Sn formed during solidification process have great impacts on the reliability of solder joints.…”

“…Ag 3 Sn IMC plates are only formed at the solidification stage of liquid Sn-Ag solders during soldering process, the intrinsic opaque character and high temperature limit the real time observation of Ag 3 Sn growth behaviors. In previous work, the growth of Ag 3 Sn is concluded according to the shape, size and distribution of Ag 3 Sn formed after soldering solidification [10][11][12]. Cooling rates are related to the sizes of Ag 3 Sn [13,14], which can explain the growth behaviors are greatly affected by the solidification process.…”

Effects of Zn addition and aging treatment on tensile properties of Sn–Ag–Cu alloys

“…Near-ternary eutectic Sn-Ag-Cu alloys such as Sn-3Ag-0.5Cu or Sn-3.8Ag-0.7Cu are the most well-known Pb-free solders worldwide [7,8]. The wettability properties and interfacial reactions in the near-eutectic Sn-Ag-Cu alloys during soldering have been studied recently [9][10][11][12][13][14][15]. However, these alloys contain approximately 3 wt.% of Ag (an expensive metal), which makes them more expensive than other Pb-free solders.…”