Evolution of the mechanical properties of Ti-based intermetallic thin films doped with different metals to be used as biomedical devices

Lopes, C.; Gabor, Camelia; Cristea, Daniel; Costa, Rui R.; Domingues, R. P.; Rodrigues, Marco S.; Borges, Joel Nuno Pinto; Alves, E.; Barradas, N.P.; Munteanu, Daniel; Vaz, F.

doi:10.1016/j.apsusc.2019.144617

Cited by 27 publications

(45 citation statements)

References 68 publications

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“…The Young’s modulus and hardness of Zr-based thin films were reported in the range of 95–121.7 GPa and 5–7 GPa, respectively [ 12 , 16 ]. Ti-based thin films showed high hardness in the range of 5–12.5 GPa and elastic modulus of 90–200 GPa [ 17 , 18 ]. Metallic thin films have recently emerged as alternative advanced surfaces for many applications, such as micro/nano-electromechanical systems and for biomedical use.…”

Section: Introductionmentioning

confidence: 99%

“…In particular, Ti-based intermetallic thin films could combine promising biocompatibility and high durability [ 18 , 20 ]. Among several available techniques, physical vapor deposition (PVD), e.g., sputtering, is one of the most commonly used techniques to coat implants [ 21 ], as the films produced by the sputtering process have very low surface roughness, which also play an important role on biofilm adhesion on Ti-based thin films [ 22 , 23 , 24 ].…”

Section: Introductionmentioning

confidence: 99%

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Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

et al. 2021

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In this work, the ternary titanium, copper, and silver (Ti-Cu-Ag) system is investigated as a potential candidate for the production of mechanically robust biomedical thin films. The coatings are produced by physical vapor deposition—magnetron sputtering (MS-PVD). The composite thin films are deposited on a silicon (100) substrate. The ratio between Ti and Cu was approximately kept one, with the variation of the Ag content between 10 and 35 at.%, while the power on the targets is changed during each deposition to get the desired Ag content. Thin film characterization is performed by X-ray diffraction (XRD), nanoindentation (modulus and hardness), to quantitatively evaluate the scratch adhesion, and atomic force microscopy to determine the surface topography. The residual stresses are measured by focused ion beam and digital image correlation method (FIB-DIC). The produced Ti-Cu-Ag thin films appear to be smooth, uniformly thick, and exhibit amorphous structure for the Ag contents lower than 25 at.%, with a transition to partially crystalline structure for higher Ag concentrations. The Ti-Cu control film shows higher values of 124.5 GPa and 7.85 GPa for modulus and hardness, respectively. There is a clear trend of continuous decrease in the modulus and hardness with the increase of Ag content, as lowest value of 105.5 GPa and 6 GPa for 35 at.% Ag containing thin films. In particular, a transition from the compressive (−36.5 MPa) to tensile residual stresses between 229 MPa and 288 MPa are observed with an increasing Ag content. The obtained results suggest that the Ag concentration should not exceed 25 at.%, in order to avoid an excessive reduction of the modulus and hardness with maintaining (at the same time) the potential for an increase of the antibacterial properties. In summary, Ti-Cu-Ag thin films shows characteristic mechanical properties that can be used to improve the properties of biomedical implants such as Ti-alloys and stainless steel.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

et al. 2021

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“…The Young's modulus and hardness of Zr-based thin films were reported in the range of 95-121.7 GPa and 5-7 GPa respectively [12,16]. In the case of Ti-based thin films which showed high hardness in the range of 5-12.5 GPa and elastic modulus of 90-200 GPa [17,18]. Especially metallic thin films have recently emerged as alternative advanced surfaces for many applications, such as micro/nano-electromechanical systems and for biomedical use.…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Rashid¹,

Sebastiani²,

Mughal³

et al. 2021

Preprint

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In this work, the ternary titanium, copper and silver (Ti-Cu-Ag) system is investigated as a potential candidate for the production of mechanically robust biomedical thin films. The coatings are produced by physical vapor deposition-magnetron sputtering (MS-PVD). The composite thin films are deposited on a silicon (100) substrate. The ratio between Ti and Cu was approximately kept one, with the variation of the Ag content between 10 and 35 at.%, while the power on the targets is changed during each deposition to get the desired Ag content. Thin film characterization is performed by x-ray diffraction (XRD), nanoindentation (modulus and hardness) and Atomic force microscopy to determine the surface topography. The residual stresses are measured by focused ion beam and digital image correlation method (FIB-DIC). The produced Ti-Cu-Ag thin films appear to be smooth, uniformly thick and exhibit amorphous structure for the Ag contents lower than 25 at.%, with a transition to partially crystalline structure for higher Ag concentrations. The Ti-Cu control film shows higher values of 124.5 GPa and 7.85 GPa for modulus and hardness respectively. There is a clear trend of continuous decrease in the modulus and hardness with the increase of Ag content, as lowest value of 105.5 GPa and 6 GPa for 35 at.% Ag containing thin films. In particular, a transition from the compressive (-36.5 MPa) to tensile residual stresses between 229 MPa and 288 MPa are observed with an increasing Ag content. The obtained results suggest that the Ag concentration should not exceed 25 at.%, in order to avoid an excessive reduction of the modulus and hardness with maintaining (at the same time) the potential for an increase of the antibacterial properties. In summary, Ti-Cu-Ag thin films shows characteristic mechanical properties that can be used to improve the properties of biomedical implants such as Ti-alloys and stainless steel.

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“…Titanium is used in air motors, aerospace structures, capacitors, valves, hip implants, fasteners, and dental casings due to its corrosion resistance characteristics and high mechanical stability [ 11 ]. This metal does not show antibacterial properties by itself, so it has become essential to integrate active bactericidal coatings when it is used as a biomaterial to prevent adhesion, colonization, and bacterial infection in implants, as these can lead to implant failure that requires surgical intervention and a supply of antibiotics [ 12 ].…”

Section: Introductionmentioning

confidence: 99%

Study of Titanium–Silver Monolayer and Multilayer Films for Protective Applications in Biomedical Devices

et al. 2021

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The search for coatings that extend the useful life of biomedical devices has been of great interest, and titanium has been of great relevance due to its innocuousness and low reactivity. This study contributes to the investigation of Ti/Ag films in different configurations (monolayer and multilayer) deposited by magnetron sputtering. The sessile droplet technique was applied to study wettability; greater film penetrability was obtained when Ag is the external layer, conferring high efficiency in cell adhesion. The morphological properties were characterized by SEM, which showed porous nuclei on the surface in the Ag coating and crystals embedded in the Ti film. The structural properties were studied by XRD, revealing the presence of TiO2 in the anatase crystalline phase in a proportion of 49.9% and the formation of a silver cubic network centered on the faces. Tafel polarization curves demonstrated improvements in the corrosion current densities of Ag/Ti/Ag/Ti/Ag/Ti/Ag/Ti and Ti/Ag compared to the Ag coating, with values of 0.1749, 0.4802, and 2.044 nA.m−2, respectively. Antimicrobial activity was evaluated against the bacteria Pseudomonas aeruginosa and Bacillus subtilis and the yeasts Candida krusei and Candida albicans, revealing that the Ti/Ag and Ag/Ti/Ag/Ti/Ag/Ti/Ag/Ti coatings exhibit promise in biomedical material applications.

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Evolution of the mechanical properties of Ti-based intermetallic thin films doped with different metals to be used as biomedical devices

Cited by 27 publications

References 68 publications

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Influence of the Silver Content on Mechanical Properties of Ti-Cu-Ag Thin Films

Study of Titanium–Silver Monolayer and Multilayer Films for Protective Applications in Biomedical Devices

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