Evolution of the nanoporous microstructure of sintered Ag at high temperature using in-situ X-ray nanotomography

Milhet, X.; Nait-Ali, Azdine; Tandiang, D.; Liu, Yijin; Campen, Douglas Van; Caccuri, Vincenzo; Legros, Marc

doi:10.1016/j.actamat.2018.06.047

Cited by 24 publications

(17 citation statements)

References 28 publications

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“…The sintering and aging conditions are shown in Table , which are chosen to be consistent with processing parameters used in electronics die attach applications as well as in relevant studies (see Supporting Information for detailed sample preparation). The effects of different conditions—pressure, aging, and metallization—on the 3D morphology were investigated, with a focus on the 3D morphology at the interface between nano‐Ag sintered powder and the substrate interface.…”

Section: Resultsmentioning

confidence: 99%

“…Prior studies focused on characterizing the mechanical properties including shear or tensile stress of the sintered Ag with different sintering time, pressure, temperature, and aging time using X-ray diffraction, scanning electron microscopy, and X-ray tomography. [11,12] Milhet et al [13] studied micron Ag paste and quantitatively analyzed the connectivity, pore geometry, pore spatial distribution, and density evolution with different aging temperature of the porous sintered Ag to study the growth, Ostwald ripening, and clustering of the pores using in situ X-ray tomography. Suzuki et al [14] used finite element analysis (FEA) to simulate the mechanical behavior based on 3D microstructures obtained from serial focused ion beam scanning electron microscopy (FIB-SEM) cross-sectional images.…”

Section: Introductionmentioning

confidence: 99%

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Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography

et al. 2020

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The sintering processing–structure–property relationship of a multiscale silver materials is investigated: microparticles with nanofeatures, particularly on their three‐dimensional (3D) morphology. The target application is to replace conventional lead‐based solders in advanced electronic manufacturing. Unlike lead‐based solders, silver powders are suited to satisfy increasingly demanding mechanical, electrical, and thermal requirements, meanwhile being free of health effect. Sintering the material at a low temperature and without applied pressure are desirable conditions, which results in a preferred use of silver nanoparticles, as nanofeatures have higher driving force to sinter with the decrease in particle size. However, nanosized powders present potential health/environmental effects. To address the trade‐off between the benefits and shortcomings of nano‐ versus microparticles, this work studies a novel multiscale silver paste, namely micron‐sized powders with nanosized features. To get quantitative 3D visualization of micro‐ and nanoscale features, ptychographic X‐ray computed nanotomography is applied. The correlations between conditions (thermal aging, pressure, and substrate metallization), mechanical properties, and morphological parameters are established. Using novel 3D X‐ray nanoimaging technique, it is demonstrated that one can design multiscale materials while balancing complex demands required in advanced electronics manufacturing and research directions in materials design and characterization.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography

et al. 2020

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“…This study conducts a nondestructive observation of the degradation process of hybrid bonding under a cyclic thermal stress test using high spatial resolution synchrotron radiation x-ray computed laminography (SRCL) measurements. [28][29][30][31][32][33][34][35] EXPERIMENTAL PROCEDURE…”

Section: Introductionmentioning

confidence: 99%

Reliability of Cu Nanoparticles/Bi-Sn Solder Hybrid Bonding Under Cyclic Thermal Stresses

Usui

Satoh

Kamiyama

et al. 2021

JOM

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The influence of thermal cycle stress loading on hybrid bonding, which was formed by sintering a mixture of Cu nanoparticles and a eutectic Bi-Sn solder powder, has been investigated. A Si chip and a directly bonded aluminum (DBA) substrate were bonded using the hybrid bonding layer. The bonded sample was evaluated using a thermal cycle test (À 40°C and 250°C). The degradation process of the sample during the test was observed nondestructively using synchrotron radiation x-ray computed laminography. The thermal cycle stress loading had a minimal effect on the microstructure of the bonding layer, which has a high bonding strength owing to the liquid phase sintering and high decomposition melting temperature of the Cu-Sn compound formation. This property reduced the Al deformation of the DBA substrate caused by the thermal cycle loading, resulting in the suppression of the bonding layer degradation. Therefore, hybrid bonding can be instrumental in achieving the reliable operation of power modules at high temperatures.

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“…Recent advances in full-field X-ray nano-imaging with transmission X-ray microscopy (TXM) (Ge et al, 2018;Xu et al, 2017;Zhao et al, 2018;Cheng et al, 2017) have generated unprecedented capabilities to analyze materials at sub-30 nm resolution in 3D. Impactful applications include energy storage (Tsai et al, 2018; Landa-Medrano et al, 2017; Yang et al, 2019), catalysis (Gonzalez-Jimenez et al, 2012), metals and alloys (Kaira et al, 2019;Milhet et al, 2018), high-pressure studies (Mao et al, 2019), and fuel cells (Chen-Wiegart, Harris et al, 2012;Harris et al, 2015;Izzo et al, 2008). Recently, the Full-field X-ray Imaging (FXI) beamline at National Synchrotron Light Source-II (NSLS-II) demonstrated that full nano-tomography images can be performed within 1 min (Ge et al, 2018), enabling dynamical and kinetic studies with much higher temporal and spatial resolutions than previously possible.…”

Section: Introductionmentioning

confidence: 99%

Versatile compact heater design forin situnano-tomography by transmission X-ray microscopy

et al. 2020

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A versatile, compact heater designed at National Synchrotron Light Source-II for in situ X-ray nano-imaging in a full-field transmission X-ray microscope is presented. Heater design for nano-imaging is challenging, combining tight spatial constraints with stringent design requirements for the temperature range and stability. Finite-element modeling and analytical calculations were used to determine the heater design parameters. Performance tests demonstrated reliable and stable performance, including maintaining the exterior casing close to room temperature while the heater is operating at above 1100°C, a homogenous heating zone and small temperature fluctuations. Two scientific experiments are presented to demonstrate the heater capabilities: (i) in situ 3D nano-tomography including a study of metal dealloying in a liquid molten salt extreme environment, and (ii) a study of pore formation in icosahedral quasicrystals. The progression of structural changes in both studies were clearly resolved in 3D, showing that the new heater enables powerful capabilities to directly visualize and quantify 3D morphological evolution of materials under real conditions by X-ray nano-imaging at elevated temperature during synthesis, fabrication and operation processes. This heater design concept can be applied to other applications where a precise, compact heater design is required.

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Evolution of the nanoporous microstructure of sintered Ag at high temperature using in-situ X-ray nanotomography

Cited by 24 publications

References 28 publications

Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography

Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography

Reliability of Cu Nanoparticles/Bi-Sn Solder Hybrid Bonding Under Cyclic Thermal Stresses

Versatile compact heater design forin situnano-tomography by transmission X-ray microscopy

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