Evolution of the tension/compression and shear cyclic stress-strain behavior of lead-free solder subjected to isothermal aging

Mustafa, M. T.; Cai, Zijie; Roberts, Jordan C.; Suhling, Jeffrey C.; Lall, Pradeep

doi:10.1109/itherm.2012.6231505

Cited by 47 publications

(5 citation statements)

References 47 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The six Anand parameters ŝ , ξ , A, Q/R, n and m are determined using a nonlinear least-squares regression fit of eq. (14) to the recorded saturation stress (UTS) vs. temperature and strain rate data. 2.…”

Section: Procedures For Determining the Anand Model Parameters From Unmentioning

confidence: 99%

“…In the current study, a vacuum suction process was utilized to form solder uniaxial test specimens with controlled microstructure in high precision rectangular cross-section glass tubes [7][8][9][10][11][12][13][14]. Initially, bulk solder material is melted in a quartz crucible using circular heating elements (see Figure 1).…”

Section: Uniaxial Test Sample Preparationmentioning

confidence: 99%

“…(14)(15) and the nonlinear regression analysis procedure discussed above. The calculated Anand parameters for SAC105, SAC205, SAC305, and SAC405 are tabulated in Table 3 and Table 4 for water quenched and reflowed samples, respectively.…”

Section: Effects Of Ag Content and Solidification Profile On The Ananmentioning

confidence: 99%

“…The effects of aging on the constitutive and failure behavior of lead free solder have been extensively investigated by the authors [7][8][9][10][11][12][13][14][15][16][17][18][19][20]. In initial work, room temperature (25 C) and elevated temperature (50, 75, 100, and 125 C) aging were shown to severely degrade the mechanical properties and creep behavior of several SAC alloys including SAC105, SAC205, SAC305, and SAC405 [7][8][9][10][11][12].…”

mentioning

confidence: 99%

“…Mustafa, et al have studied the aging-induced changes occurring in the cyclic stress-strain behavior of lead free SAC solders for both tension/compression [13] and shear [14] loadings. The effects of several parameters were examined including aging time, temperature, strain/stress limits, and solder alloy composition.…”

mentioning

confidence: 99%

See 4 more Smart Citations

The effects of silver content and solidification profile on the Anand constitutive model for SAC lead free solders

Basit

Motalab

Roberts

et al. 2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Self Cite

View full text Add to dashboard Cite

In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically.The nine Anand parameters were determined for each unique solder alloy and microstructure from a set of stressstrain tests performed at several strain rates and temperatures. Testing conditions included strain rates of 0.001, 0.0001, and 0.00001 (sec -1 ), and temperatures of 25, 50, 75, 100, and 125 C. The Anand parameters were calculated from each set of stress-strain data using an established procedure that is described in detail in the paper. Using the calculated results for the various SAC alloys and microstructures, a set of empirical models have been established to describe the effects of SAC alloy Ag content on the Anand model parameters.As expected, the mechanical properties (modulus and strength) increase with the percentage of Ag content, and these changes strongly affect the Anand parameters. The sensitivity of the mechanical properties and Anand parameters to silver content is higher at lower silver percentages (1-2%). Also, the observed mechanical properties of water quenched samples were better (higher in magnitude) than the corresponding mechanical properties of the reflowed samples. Although the differences in elastic modulus between the water quenched and reflowed samples are small, significant differences are present for the yield and ultimate tensile stresses of all four SAC alloys. After deriving the Anand parameters for each alloy, the stress-strain curves have been calculated for various conditions, and excellent agreement was found between the predicted results and experimental stress-strain curves.

show abstract

Section: Procedures For Determining the Anand Model Parameters From Unmentioning

confidence: 99%