Evolution of thermal stress in millisecond laser manufacturing

Zhang, Tingzhong; Zhang, Chengguang; Zhang, Liang; Jin, Li

doi:10.1016/j.optcom.2020.126592

Cited by 3 publications

(3 citation statements)

References 19 publications

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“…To date, the most common LBM modeling approaches involve volume of fluid (VOF) method and the level set method [42,43]. These methodologies have proven successful in simulation of LBM processes in various metals and ceramics, such as creating blind holes in aluminum [43] and through holes in alumina [42], capturing temperature field in alumina [44] and stress field in aluminum [45], simulating hole shape variations in steel [46], and predicting entrance and exit diameters in C/SiC [29]. It is worth noting that VOF computes and tracks the volume fraction of a specific phase in each cell.…”

Section: Continuous Wave Lasermentioning

confidence: 99%

Hole formation mechanisms in double-sided laser drilling of Ti6Al4V-C/SiC stacked materials

Gao,

Liu,

Liu

et al. 2024

Journal of Materials Processing Technology

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Section: Continuous Wave Lasermentioning

confidence: 99%

Hole formation mechanisms in double-sided laser drilling of Ti6Al4V-C/SiC stacked materials

Gao,

Liu,

Liu

et al. 2024

Journal of Materials Processing Technology

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“…In recent years, improved millisecond laser manufacturing has been applied to construct a series of micro/nanostructures with various shapes and sizes on different materials with desired performance owing to its cheaper and faster features. [54][55][56] However, few studies have been reported on the application of millisecond pulsed laser-texturing for the fabrication of micro/nano sensors.…”

Section: Millisecond Lasersmentioning

confidence: 99%

Laser Micro/Nano‐Structuring Pushes Forward Smart Sensing: Opportunities and Challenges

Zhang

Wang

Yan

et al. 2022

Adv Funct Materials

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Post‐pandemic era poses an imperative demand on progressive sensing devices whose performance largely relies on the morphologies and structures of sensing materials. Despite substantial efforts and advances that have been made in sensing materials with different micro/nanoscale dimensionalities, it is still challenging to couple micro/nano platforms with sensing materials together for the precise and scalable production of high‐performance sensors toward practical application scenarios. Owing to noncontact, precise, and high‐efficiency features, laser micro/nanofabrication offers a promising solution to achieve high‐quality micro/nano sensors with novel functionalities in a relatively short time. Herein, this review begins with a glance over the development of micro/nano‐structured sensors and briefly discusses the importance of laser micro/nanostructuring technology for micro/nano‐engineering of the sensors. Next, representative processing methods are elaborated in detail from a laser‐pulse‐type point of view, with potential applications toward chemical, physical, and biological targets based on different sensing mechanisms summarized. Finally, the perspectives on the opportunities and challenges of laser micro/nanostructuring strategies and materials for micro/nanosensors are presented.

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“…It is necessary to study the effect of thermal stress which affects the physical and mechanical behavior of material surface in EDM process. Zhang et al [15] established an online monitoring method composed of a level-set method, thermal transfer theory, and stress field retrieving for real-time stress analysis during laser drilling. Li et al [16] conducted a thermodynamic analysis of plasma during micro-EDM of monocrystalline silicon.…”

Section: Introductionmentioning

confidence: 99%

Using wire electrical discharge machining to investigate process indicators of Polysilicon removal mechanism

Hongfei,

Gong,

Zhu

et al. 2024

Preprint

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This paper examines the effect of processing parameters of wire electrical discharge machining (WEDM) on the processing indicators of polysilicon. The WEDM, based on COMSOL Multiphysics software, established a thermal-fluid-solid coupling model of polysilicon single pulse discharge. The simulation results show that thermal stress spalling is polysilicon’s primary material removal mechanism during EDM. And through the EDM experiment to verify the accuracy of the simulation model. Based on single-factor experiments, this paper examined the influences of processing parameters on polysilicon processing indicators. The experimental results indicated that open voltage, pulse width, feed velocity, surface roughness (Sa), and material removal rate (MRR) showed a generally increasing trend. In contrast, the influence of pulse interval ratio and feed velocity on the Sa and MRR evinced a nonlinear relationship. These findings could be references for future research on wire EDM’s process optimization and machining.

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Evolution of thermal stress in millisecond laser manufacturing

Cited by 3 publications

References 19 publications

Hole formation mechanisms in double-sided laser drilling of Ti6Al4V-C/SiC stacked materials

Hole formation mechanisms in double-sided laser drilling of Ti6Al4V-C/SiC stacked materials

Laser Micro/Nano‐Structuring Pushes Forward Smart Sensing: Opportunities and Challenges

Using wire electrical discharge machining to investigate process indicators of Polysilicon removal mechanism

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