eWLB SiP with Sn finished passives

Toole, Eoin O; Almeida, Rui; Campos, J.; Martins, Aline Maria Araújo; Cardoso, André; Cardoso, Fabbryccio A. C. M.; Kroehnert, Steffen

doi:10.1109/estc.2014.6962746

Cited by 1 publication

(1 citation statement)

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“…Several concepts for MEMS and IC integration through flip-chip bonding are being used in applications such as RF-MEMS 22 , micro-opto-electro-mechanical system [23][24][25] and MEMS sensors 26,27 , and a general study investigating various MEMS test structures has been reported 28 . More recent concepts for chip-to-chip and chip-to-package interconnections have been developed based on thin-film interconnects between embedded chips [29][30][31][32][33] . This method has been commercially exploited in fan-out wafer-level packaging concepts, including the wafer-level ball grid arrays developed by Infineon and there distributed chip packages developed by Freescale Semiconductor Inc, Austin, Texas, USA 34 .…”

Section: Hybrid Integration Of Mems and Ics: Multi-chip Solutionsmentioning

confidence: 99%

Integrating MEMS and ICs

et al. 2015

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The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs typically provide functionalities related to the signals of these transducers, such as analog-to-digital conversion, amplification, filtering and information processing as well as communication between the MEMS transducer and the outside world. Thus, the vast majority of commercial MEMS products, such as accelerometers, gyroscopes and micro-mirror arrays, are integrated and packaged together with ICs. There are a variety of possible methods of integrating and packaging MEMS and IC components, and the technology of choice strongly depends on the device, the field of application and the commercial requirements. In this review paper, traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed. These include approaches based on the hybrid integration of multiple chips (multi-chip solutions) as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques. These are important technological building blocks for the 'More-ThanMoore' paradigm described in the International Technology Roadmap for Semiconductors. In this paper, the various approaches are categorized in a coherent manner, their merits are discussed, and suitable application areas and implementations are critically investigated. The implications of the different MEMS and IC integration approaches for packaging, testing and final system costs are reviewed.

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