Laser processing is one of the most popular small-scale patterning methods and has many applications in semiconductor device fabrication and biomedical engineering. Numerical modelling of this process can be used for better understanding of the process, optimization, and predicting the quality of the final product. An accurate 3D model is presented here for short laser pulses that can predict the ablation depth and temperature distribution on any section of the material in a minimal amount of time. In this transient model, variations of thermal properties, plasma shielding, and phase change are considered. Ablation depth was measured using a 3D optical profiler. Calculated depths are in good agreement with measured values on laser treated titanium surfaces. The proposed model can be applied to a wide range of materials and laser systems.