2012
DOI: 10.1007/s10973-011-2183-4
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Examination of Zinc coatings on Copper substrates by thermal analysis

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Cited by 6 publications
(3 citation statements)
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“…Moreover, a major asset of this procedure is the formation of homogeneous coatings over irregularly shaped objects. [11][12][13] By this technique, copper substrates, magnesium or aluminium, and a filler are packed and sealed into a crucible with a halide salt (in our case NH 4 Cl), which is the activator of the chemical system. Afterwards, the crucible is heated in inert atmosphere at a fixed deposition temperature and time.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Moreover, a major asset of this procedure is the formation of homogeneous coatings over irregularly shaped objects. [11][12][13] By this technique, copper substrates, magnesium or aluminium, and a filler are packed and sealed into a crucible with a halide salt (in our case NH 4 Cl), which is the activator of the chemical system. Afterwards, the crucible is heated in inert atmosphere at a fixed deposition temperature and time.…”
Section: Introductionmentioning
confidence: 99%
“…This is accomplished chemically using a halide activator (NH 4 Cl), which decomposes over 200uC forming NH 3 and HCl vapours, which react with the metallic powder (Al or Mg) forming the corresponding chloride vapours. 4,[11][12][13][14] These vapours dissociate either by reacting with H 2 , produced in the reaction of HCl with the metal powder, or by reacting with Cu substrate. [15][16][17] The final result is the deposition of metallic Al or Mg on the surface of the Cu substrate, while metallic chlorides are regenerated, recycling the chemical process.…”
Section: Introductionmentioning
confidence: 99%
“…The data on gas phase composition and stability during transport in the CVD equipment are used in selection of the appropriate conditions [10]. These parameters are necessary for ascertaining of the evaporation temperature, CVD heating regime and finally the precursor decomposition temperature on the substrate surface in the last stage of the layer formation.…”
Section: Introductionmentioning
confidence: 99%