Examination the effect of thermal shock test on SAC solder joints fabricated by THRS and multiwave soldering techniques

Koncz-Horváth, Dániel; Molnár, Alíz; Gergely, Gréta; Pal, Manoj Kumar; Gácsi, Zoltán

doi:10.1556/2051.2019.00058

Cited by 5 publications

(1 citation statement)

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The impact of the thermal shock was investigated on SAC-305 welding joints, which are the most viable solder materials used for the soldering of dual in-line packages. Two different profiles, À30/1110°C and À40/1125°C, were set and solder joints were subjected to them Horvath et al (2019). Pan et al (2009) investigated the effects of thermal shock and ageing on the intermetallic compound for SAC-305 solder joints.…”

Section: Introductionmentioning

confidence: 99%

An experimental study of carbonyl powder power inductor cracking during reflow process

Rehman

Asghar

Iqbal

et al. 2020

SSMT

View full text Add to dashboard Cite

Purpose In surface mount assembly (SMA) process, small components are subjected to high temperature variations, which result in components’ deformation and cracking. Because of this phenomenon, cracks are formed in the body of carbonyl powder ceramic inductor (CPCI) in the preheat and cooling stages of the reflow oven. These cracks become the main cause of board failure in the ageing process. The purpose of this paper is to ascertain the thermal stress, thermal expansion of carbonyl iron ceramics and its effects on crack commencement and proliferation in the preheat stage of reflow oven. Moreover, this paper also categorized and suggested important parameters of reflow profile that could be used to eliminate these thermal shock failures. Design/methodology/approach In this paper, two different reflow profiles were studied that evaluate the thermal shock of CPCI during varying ΔT at the preheat zone of the reflow oven. In the first profile, the change in temperature ΔT at preheat zone was set to 3.26°C/s, which has resulted in a number of device failures because of migration of micro cracks through the CPCI. In the second profile, this ΔT at preheat stage is minimized to 2.06°C/s that eliminated the thermal stresses; hence, the failure rates were significantly reduced. Findings TMPC0618H series lead (Pb)-free CPCI is selected for this study and its thermal expansion and thermal shock are observed in the reflow process. It is inferred from the results that high ΔT at preheat zone generates cracks in the carbonyl powder-type ceramics that cause device failure in the board ageing process. Comparing materials, carbonyl powder ceramic components are less resistant to thermal shock and a lower rate of temperature change is desirable. Originality/value The proposed study presents an experimental analysis for mitigating the thermal shock defects. The realization of the proposed approach is validated with experimental data from the printed circuit boards manufacturing process.

show abstract

Section: Introductionmentioning

confidence: 99%

An experimental study of carbonyl powder power inductor cracking during reflow process

Rehman

Asghar

Iqbal

et al. 2020

SSMT

View full text Add to dashboard Cite

show abstract

SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux

Veselý,

Králová,

Pilnaj

et al. 2024

Adv Eng Mater

View full text Add to dashboard Cite

An intermetallic layer (IML) between the solder alloy and the soldered surface affects the mechanical and electrical performance of the resulting joints. Numerous studies have explored the possibilities of influencing the IML to achieve more reliable interconnections. However, the type and composition of the used flux, crucial for the proper creation of solder joints, is rarely included as a possible influencing factor. In this article, a comprehensive study on the interfacial microstructure evolution of lead‐free SnAgCu solder joints, accounting for the flux type and the temperature of the preheating phase of reflow soldering, where the flux contained in the solder paste becomes active, is presented. In the results, it is shown that the IML of as‐reflowed and thermally aged solder joints depends significantly on the flux. The IML activation energy is 57% higher for rosin‐based low‐activity (ROL)0 flux compared to ROL1 flux. The ROL0 flux, containing fewer active components, also outperforms the ROL1 flux in both the mechanical and electrical properties of the joints. Furthermore, the temperature profiles also show slight differences in measured properties, with the fluxes responding differently to changes in preheating temperature. In the presented results, importance of the used flux on solder joint microstructure is demonstrated.

show abstract

Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys

Varanasi

Pal

2021

Powder Metall Met Ceram

View full text Add to dashboard Cite

Examination the effect of thermal shock test on SAC solder joints fabricated by THRS and multiwave soldering techniques

Cited by 5 publications

References 21 publications

An experimental study of carbonyl powder power inductor cracking during reflow process

An experimental study of carbonyl powder power inductor cracking during reflow process

SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux

Density and Dynamic Viscosity of Sn, Sn–Ag, and Sn–Ag–Cu Liquid Lead-Free Solder Alloys

Contact Info

Product

Resources

About