2015
DOI: 10.1016/j.ijthermalsci.2015.01.006
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Exceptionally high thermal conductivity of thermal grease: Synergistic effects of graphene and alumina

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Cited by 138 publications
(69 citation statements)
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“…It is observed that heat conductivity first increases linearly with the degree of agglomeration, reaches a maximum at the percolation threshold and finally decreases. The raising of conductivity with size (at nanoscale) was confirmed by many authors [46][47][48][49][50][51] in the case of epoxy resin with various fillers and by Prasher et al [31,52] in the case of nanofluids.…”
Section: Final Validation Of Dependence Of the Effective Thermal Condmentioning
confidence: 70%
“…It is observed that heat conductivity first increases linearly with the degree of agglomeration, reaches a maximum at the percolation threshold and finally decreases. The raising of conductivity with size (at nanoscale) was confirmed by many authors [46][47][48][49][50][51] in the case of epoxy resin with various fillers and by Prasher et al [31,52] in the case of nanofluids.…”
Section: Final Validation Of Dependence Of the Effective Thermal Condmentioning
confidence: 70%
“…An excellent TIM with high heat dissipation and high deformability must properly align to the surface topography of the mating surfaces and can also replace air and fill in the voids at the interface (Yu et al 2015c). Due to the superiority of TIM's heat dissipation when compared to that of the replaced air at 0.026 W/m K, the interfacial thermal resistance is minimized resulting in reduced temperature of the electronic component junction.…”
Section: Thermal Conductivity Of Pcmsmentioning
confidence: 99%
“…Due to the superiority of TIM's heat dissipation when compared to that of the replaced air at 0.026 W/m K, the interfacial thermal resistance is minimized resulting in reduced temperature of the electronic component junction. Presently, TIMs can be classified as elastomeric thermal pads, PCMs, thermal greases, and solders (Yu et al 2015c). Thermal grease is a type of thixotropic paste with high heat dissipation, capable of effectively filling the gaps of the mating surface.…”
Section: Thermal Conductivity Of Pcmsmentioning
confidence: 99%
“…Hybrid size particles filler can improve the thermal conductivity of the TFCs [79][80][81][82]. As can be seen from Figure 11, the small particles can easily occupy the space between the adjacent large particles, which leads to larger packing density of the filler in the matrix and lower thermal resistance among adjacent conductive filler [83]. Due to the high thermal conductivity and large aspect ratio, CNT attracted great attention as hybrid filler with particles for thermal conductivity enhancement of TFCs.…”
Section: The Synergistic Effect Of 1d Nanomaterials and 0dmentioning
confidence: 99%
“…Small particle (!F 2 / 3 ) Figure 11: Schematic for the distribution of hybrid size alumina particles [83].…”
Section: The Synergistic Effect Of 1d Nanomaterials and 0dmentioning
confidence: 99%