1992
DOI: 10.1007/bf00324201
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Excimer laser ablation of polyimide in a manufacturing facility

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Cited by 90 publications
(30 citation statements)
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“…As diameter decrease (below 100µm) lasers are preferred over mechanical drills. Since copper is highly reflective thus, Q-switched Nd: YAG lasers (fundamental or 3rd-harmonic) are used to drill the metal, while CO 2 lasers are used to drill the dielectric material.Drilling microvias by ablation was first investigated in the early 1980's using pulsed Nd:YAG and CO 2 lasers [23,24].Excimer lasers led the way in applying it to volume production when the Nixdorf computer plant introduced polyimide ablative drilling of 80µm diameter vias in MCM's -as used to connect silicon chips together in high-speed computers [25].Other mainframe computer manufacturers such as IBM rapidly followed suite and installed their very own production lines for this application [26,27]. With fewer process steps than other methods, laser-drilling is regarded as the most versatile, robust, reliable and high-yield technology for creating microvias in thin film packages.…”
Section: Microvia Hole Drilling In Circuit Intermentioning
confidence: 99%
“…As diameter decrease (below 100µm) lasers are preferred over mechanical drills. Since copper is highly reflective thus, Q-switched Nd: YAG lasers (fundamental or 3rd-harmonic) are used to drill the metal, while CO 2 lasers are used to drill the dielectric material.Drilling microvias by ablation was first investigated in the early 1980's using pulsed Nd:YAG and CO 2 lasers [23,24].Excimer lasers led the way in applying it to volume production when the Nixdorf computer plant introduced polyimide ablative drilling of 80µm diameter vias in MCM's -as used to connect silicon chips together in high-speed computers [25].Other mainframe computer manufacturers such as IBM rapidly followed suite and installed their very own production lines for this application [26,27]. With fewer process steps than other methods, laser-drilling is regarded as the most versatile, robust, reliable and high-yield technology for creating microvias in thin film packages.…”
Section: Microvia Hole Drilling In Circuit Intermentioning
confidence: 99%
“…Debris can contribute to beam attenuation after ejection but before deposition [5] and can be generated in a mode that coats unimportant areas, areas still to be machined, or, worse still, features that have already been machined [6]. To compound matters, debris can coat machinery, requiring costly downtime for cleaning and servicing [7], or can become airborne in the working environment of tool users, posing potential respiratory health issues [7]. The use of a technique involving closed flowing thick film filtered water immersion of the sample during laser ablation has shown promise as a solution to such problems [9]; however, the impact of such techniques on the basic laser machining characteristics are not extensively documented.…”
Section: Background and Rationalmentioning
confidence: 99%
“…3,4 The impetus for development of laser micromachining has come largely from the electronics industry, where excimer lasers have been used extensively for via drilling in chip packages and printed wiring boards. 5,6 However, excimer lasers have also found applications across a much wider range of industries, covering a variety of materials from polymers to metals and ceramics. 7 Their ability to etch biological materials without collateral damage has also led to a number of surgical applications.…”
Section: Introductionmentioning
confidence: 99%