Experiment of New Radiator in Electronic Device

Abstract

The experimental apparatus is set up to test the heat transfer performance of the new radiator, which mainly includes vacuum-pumping and central processing unit (CPU) tunnel system, heating system and measurement system. The heat dissipation of the CPU chip is imitated by the copper bar which is heated by thermal resistance wire. The experimental results show that the temperature of the CPU chip decrease with growing of cooling air velocity, but the temperature drop tendency becomes gentle when it continues to increase. Higher heat dissipation power results in higher CPU chip temperature, but oversized heat flux density makes the phase changing process worse.