Experimental analysis of failure in embedded electronics and mechatronical systems under thermal stress

Experimental Analysis of Thermo‐mechanical Behaviour of Electronic Components with Speckle Interferometry

“…This explains the considerable number of studies carried out on electronic components to investigate interfacial crack behaviour, thermo‐mechanical properties with special emphasis on thermal expansion coefficients, response to thermal loading, residual deformations/stresses induced by soldering, etc. (see, for example, and the references cited in those papers). Furthermore, full‐field displacement information provided by OT is very useful for finite element verification and hybrid analysis of structural behaviour of electronic packages (see, for example, ).…”

“…In spite of the inherent advantages of PSESPI, there are not many examples of application of this technique to transient and/or fatigue analysis of thermo‐mechanical behaviour of electronic chip/components in real time (for example, the pioneering studies and the comprehensive study considered only the stationary conditions after the transient phase). In fact, the most recent literature on Non‐Destructive Evaluation (NDE) of electronic packages is focused on the use of ESPI either to determine thermal expansion coefficients or to assess precisely material parameters and correctly identify boundary conditions .…”

Vibration Measurement by Speckle Interferometry between High Spatial and High Temporal Resolution

“…2 (Nistea & Borza, 2010a). Filtering a time-averaged hologram by convolution with an average or other low-pass filter may reduce the high-frequency noise, but strongly affects the fringe resolution and contrast.…”