Experimental Analysis of Hardness and Densification of Microwave Sintered AL/SIC/AL2O3/Flyash Composites

Swaminathan, G.; Prasad, A. Rajendra; Suresh, Sumit; Vignesh, C.

doi:10.17485/ijst/2016/v9i42/103308

Cited by 4 publications

(1 citation statement)

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“…Somani et al (2019) have worked on Cu-SiC composite and concluded that the addition of SiC has improved the mechanical and tribological properties. Swaminathan et al (2016) concluded that the addition of SiC has increased the mechanical properties of the composite. Hussain et al (2017) have worked on Cu- Al 2 O 3 composite for EDM electrode and also observed the effect of addition of Al 2 O 3 .…”

Section: Introductionmentioning

confidence: 99%

An investigation on the influence of sintering temperature on microstructural, physical and mechanical properties of Cu-SiC composites

Somani

Tyagi

Gupta

2021

JEDT

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Purpose The purpose of this study is to investigate the effect of the sintering temperature on the microstructural, mechanical and physical properties of Cu-SiC composites. Design/methodology/approach The powder metallurgy route was used to fabricate the samples. Cold compaction of powders was conducted at 250 MPa which was followed by sintering at 850°C–950°C at the interval of 50 °C in the open atmospheric furnace. SiC was used as a reinforcement and the volumetric fraction of the SiC was varied as 10%, 15% and 20%. The processed samples were metallurgically characterized by the scanning electron microscope (SEM). Mechanical characterization was done using tensile and Vickers’ micro-hardness testing to check the hardness and strength of the samples. Archimedes principle and Four-point collinear probe method were used to measure the density and electrical resistivity of the samples. Findings SEM micrograph reveals the uniform dispersion of the SiC particles in the Cu matrix element. The results revealed that the Hardness and tensile strength were improved due to the addition of SiC and were maximum for the samples sintered at 950 °C. The addition of SiC has also increased the electrical resistivity of the Cu-SiC composite and was lowest for Cu 100% while the relative density has shown the reverse trend. Further, it was found that the maximum hardness of 91.67 Hv and ultimate tensile strength of 312.93 MPa were found for Cu-20% SiC composite and the lowest electrical resistivity of 2.017 µ- Ω-cm was found for pure Cu sample sintered at 950 °C, and this temperature was concluded as the optimum sintering temperature. Research limitations/implications The powder metallurgy route for the fabrication of the composites is a challenging task as the trapping of oxygen cannot be controlled during the compaction process as well as during the sintering process. So, a more intensive study is required to overcome these kinds of limitations. Originality/value As of the author’s best knowledge, no work has been reported on the effect of sintering temperature on the properties of the Cu-SiC composites which has huge potential in the industries.

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Section: Introductionmentioning

confidence: 99%