“…At present, the methods enhancing the heat dissipation of PCM can be mainly divided into two categories. One is increasing the thermal conductivity of PCM by adding high thermal conductive particles or fillers to fabricate composite PCM, such as paraffin wax/expanded graphite (paraffin wax/EG) [5,6], paraffin wax/metal foams [7][8][9], and paraffin wax/nano-materials [10,11]. The other one is placing high thermal conductivity inserts into PCM through structure design, such as aluminum fins [12,13], capillary driven heat pipe, gravity assisted heat pipe (GHP) [14][15][16][17][18][19], and others.…”