1997
DOI: 10.1088/0960-1317/7/4/007
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Experimental analysis on the anodic bonding with an evaporated glass layer

Abstract: We performed a silicon-to-silicon anodic bonding process using a glass layer deposited by electron beam evaporation. Corning No 7740 Pyrex glass was used as the source material of electron evaporation. The effects on the bonding process were investigated as a function of the thickness of the glass layer and the concentration of sodium ions in the glass layer. The surface roughness of the glass layer decreased with increasing thickness of the glass layer. It was observed that the deposited glass layers of more … Show more

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Cited by 16 publications
(6 citation statements)
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“…The bonding of the free glass surface to the second silicon conductor is then the same as in conventional anodic bonding. 69,[95][96][97] In the second type non-conducting interlayers are used between silicon wafers, for instance thermally grown silicon oxide, sputtered quartz or sputtered silicon nitride. 100,101 The two surfaces to be bonded are brought into intimate contact by an electrostatic force originating from a voltage drop over the gap between the two materials and the non-conducting film on the substrate.…”
Section: Use Of Interlayersmentioning
confidence: 99%
“…The bonding of the free glass surface to the second silicon conductor is then the same as in conventional anodic bonding. 69,[95][96][97] In the second type non-conducting interlayers are used between silicon wafers, for instance thermally grown silicon oxide, sputtered quartz or sputtered silicon nitride. 100,101 The two surfaces to be bonded are brought into intimate contact by an electrostatic force originating from a voltage drop over the gap between the two materials and the non-conducting film on the substrate.…”
Section: Use Of Interlayersmentioning
confidence: 99%
“…R glass-Si is the interface resistance between the 2.5 Pm glass thin film and the polished silicon wafer. We expect R glass-Si to be small because the glass layer was deposited using electron beam evaporation, which is known to yield conformal coverage of the evaporated material [20]. R glass-CNT is the critical interface resistance of interest between the carbon nanotube array free tips and the thin glass film.…”
Section: Thermal Characterizationmentioning
confidence: 99%
“…Silicon-to-silicon anodic bonding is similar to the microscopic process of silicon to glass anodic bonding [10]. The experimental set-up for the silicon-to-silicon bonding is illustrated in figure 2.…”
Section: Silicon-to-silicon Anodic Bondingmentioning
confidence: 99%