Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density

Jia, Fu; Niu, Leyi; Yao, Xi; Qiu, Yuanying; Ma, Hui; Yang, Chi

doi:10.1016/j.ijheatmasstransfer.2022.123719

Cited by 7 publications

(3 citation statements)

References 45 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…D. Straubinger et al [ 13 ] demonstrated the reduction of shear strength in solder joints under current loading and isothermal aging. The formation of voids in the solder layer during the flow of current can also lead to the appearance and increase in the joint TR [ 14 ]. The voids are formed as a result of the electromigration of solder atoms when an electric current flows through the contact.…”

Section: Introductionmentioning

confidence: 99%

“…Such devices include, for example, photovoltaic solar cells with radiation concentrators working at high levels of light irradiation [ 15 ] and high-voltage pulse semiconductor switches based on a diode stack assembly [ 16 ]. A detailed theoretical and experimental consideration of electromigration of atoms and the dynamics of the void formation in solder layers was performed by F. Jia et al [ 14 ].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Laser Thermal Wave Diagnostics of the Thermal Resistance of Soldered and Bonded Joints in Semiconductor Structures

Глазов

Muratikov

2023

Sensors

View full text Add to dashboard Cite

This paper is a review of recent applications of a laser photothermal mirage technique for sensing and measuring the thermal resistance of joint layers in modern electronic devices. A straightforward theoretical model of the interfacial thermal resistance based on the formation of a thin intermediate layer between jointed solids is described. It was experimentally shown that thermal properties of solder layers cannot be evaluated simply on the base of averaging the thermal properties of solder components. The review presents the laser thermal wave methodology for measuring thermal parameters of soldered and adhesively bonded joints. The developed theoretical model makes it possible to carry out a quantitative estimation of local thermal conductivities of joints and their thermal resistances by fitting theoretical results with experimental data obtained by the laser beam deflection method. The joints made with lead-containing and lead-free solders were studied. The anomalous distribution of thermal properties in the solder layer is explained by the diffusion of various atoms detected by energy dispersive X-ray spectroscopy. The laser beam deflection method made it possible to reveal a strong influence of the surface pretreatment quality on the interfacial thermal resistance.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Laser Thermal Wave Diagnostics of the Thermal Resistance of Soldered and Bonded Joints in Semiconductor Structures

Глазов

Muratikov

2023

Sensors

View full text Add to dashboard Cite

show abstract

“…Therefore, it is of great significance to investigate the electromigration characteristics of solder joints. Jia et al (2023) conducted experiments and dynamic multi-physics field simulations to study the atomic migration behavior, void formation and heat transfer characteristics under high current density. The experiment results showed that voids primarily appeared in small sizes and distributed near the inlet of electron flow.…”

Section: Introductionmentioning

confidence: 99%

Temperature and current density prediction in solder joints using artificial neural network method

Liu,

Xu,

et al. 2023

SSMT

View full text Add to dashboard Cite

Purpose Due to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the reliability of electronic devices. The purpose of this study is to propose a finite element-artificial neural network method for the prediction of temperature and current density of solder joints, and thus provide reference information for the reliability evaluation of solder joints. Design/methodology/approach The temperature distribution and current density distribution of the interconnect structure of electronic devices were investigated through finite element simulations. During the experimental process, the actual temperature of the solder joints was measured and was used to optimize the finite element model. A large amount of simulation data was obtained to analyze the neural network by varying the height of solder joints, the diameter of solder pads and the magnitude of current loads. The constructed neural network was trained, tested and optimized using this data. Findings Based on the finite element simulation results, the current is more concentrated in the corners of the solder joints, generating a significant amount of Joule heating, which leads to localized temperature rise. The constructed neural network is trained, tested and optimized using the simulation results. The ANN 1, used for predicting solder joint temperature, achieves a prediction accuracy of 96.9%, while the ANN 2, used for predicting solder joint current density, achieves a prediction accuracy of 93.4%. Originality/value The proposed method can effectively improve the estimation efficiency of temperature and current density in the packaging structure. This method prevails in the field of packaging, and other factors that affect the thermal, mechanical and electrical properties of the packaging structure can be introduced into the model.

show abstract

Correlations of microstructure and mechanical and thermal parameters of solder joints by X-ray CT and simulations

Jia,

Zhang,

et al. 2024

International Communications in Heat and Mass Transfer

View full text Add to dashboard Cite

Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density

Cited by 7 publications

References 45 publications

Laser Thermal Wave Diagnostics of the Thermal Resistance of Soldered and Bonded Joints in Semiconductor Structures

Laser Thermal Wave Diagnostics of the Thermal Resistance of Soldered and Bonded Joints in Semiconductor Structures

Temperature and current density prediction in solder joints using artificial neural network method

Correlations of microstructure and mechanical and thermal parameters of solder joints by X-ray CT and simulations

Contact Info

Product

Resources

About