2018
DOI: 10.1007/s40032-018-0445-7
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Experimental and Numerical Investigation of Forced Convection Heat Transfer in Heat Sink with Rectangular Plates at Varying Inclinations on Vertical Base

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Cited by 7 publications
(3 citation statements)
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“…Furthermore, for a given air stream, the maximum forced convection HTC is expected to be present for attached boundary layers at small angles of attack, as the HTC was found here to decrease significantly with increased angle of attack (see Figure 11). This is comparable to results from Test et al [22,38], which again support the reliability of these results.…”
Section: Discussionsupporting
confidence: 90%
“…Furthermore, for a given air stream, the maximum forced convection HTC is expected to be present for attached boundary layers at small angles of attack, as the HTC was found here to decrease significantly with increased angle of attack (see Figure 11). This is comparable to results from Test et al [22,38], which again support the reliability of these results.…”
Section: Discussionsupporting
confidence: 90%
“…The current study was conducted for heat sinks commonly employed in various industrial applications, including but not limited to the cooling of small electronic components, central processing units (CPUs) in personal computers and data centers, electronic boards, advanced electronic chips, electrical devices such as computer power supplies and substation transformers, the aerospace sector, and the cooling of fuel elements in nuclear reactors (Upalkar et al, 2020). [29][30][31][32][33] In the existing literature on heat sink optimization through perforations, the majority of studies have concentrated on single types of perforations (Zohora et al, 2023), 2,8,11,34,35 leading to a fragmented understanding of circular perforated cylindrical fin pin heat sink performance.…”
Section: Introductionmentioning
confidence: 99%
“…The current study was conducted for heat sinks commonly employed in various industrial applications, including but not limited to the cooling of small electronic components, central processing units (CPUs) in personal computers and data centers, electronic boards, advanced electronic chips, electrical devices such as computer power supplies and substation transformers, the aerospace sector, and the cooling of fuel elements in nuclear reactors (Upalkar et al, 2020) 29–33 …”
Section: Introductionmentioning
confidence: 99%