2017
DOI: 10.1115/1.4036404
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Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Abstract: Three-dimensional integrated circuits (3D ICs) attract much interest due to several advantages over traditional microelectronics design, such as electrical performance improvement and reducing interconnect delay. While the power density of 3D ICs increases because of vertical integration, the available substrate area for heat removal does not change. Thermal modeling of 3D ICs is important for improving thermal and electrical performance. Experimental investigation on the thermal measurement of 3D ICs and dete… Show more

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Cited by 14 publications
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