2017
DOI: 10.1016/j.microrel.2017.03.022
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Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board

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Cited by 13 publications
(7 citation statements)
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“…The effect of flow and thermal-induced deflection, von Mises stress and heat transfer had been coupled concurrently in the simulation. The numerical findings and experimental results were validated in good agreement (Lim et al, 2017b(Lim et al, , 2020. Similar simulation methods had been used in the FPCB's idle state study (Lim et al, 2017c;Leong et al, 2013b), biomedical engineering (Lopes et al, 2020) and microelectronics study (Abdul Aziz et al, 2015b.…”
Section: Modelling Approachmentioning
confidence: 60%
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“…The effect of flow and thermal-induced deflection, von Mises stress and heat transfer had been coupled concurrently in the simulation. The numerical findings and experimental results were validated in good agreement (Lim et al, 2017b(Lim et al, , 2020. Similar simulation methods had been used in the FPCB's idle state study (Lim et al, 2017c;Leong et al, 2013b), biomedical engineering (Lopes et al, 2020) and microelectronics study (Abdul Aziz et al, 2015b.…”
Section: Modelling Approachmentioning
confidence: 60%
“…The current technique was similar to the one used in Ref. (Lim et al, 2017b(Lim et al, , 2017d(Lim et al, , 2017a. The effect of flow and thermal-induced deflection, von Mises stress and heat transfer had been coupled concurrently in the simulation.…”
Section: Modelling Approachmentioning
confidence: 99%
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“…Indeed the present method was same as the one used by Lim et al (2017d), in which the effect of thermal and flow has been coupled simultaneously in the simulation. The grid independency test has been presented by Lim et al (2017d) while the numerical results were validated in good agreement with the experimental findings (Lim et al, 2017b(Lim et al, , 2017d. Beside, similar simulation approaches had been used in the integrated circuit encapsulation investigation (Khor et al, 2012), FPCB's idle state study (Lim et al, 2017c) and wave soldering process analysis (Abdul Aziz et al, 2015).…”
Section: Modelling Toolsmentioning
confidence: 73%