Experimental and Numerical Study of Thermal Residual Stresses on Multimaterial Adherends in Single-Lap Joints

Simões, Beatriz D.; Nunes, P.D.P.; Ramezani, Farin; Carbas, R.J.C.; Marques, E.A.S.; Silva, Lucas F. M. da

doi:10.3390/ma15238541

Cited by 12 publications

(5 citation statements)

References 51 publications

(74 reference statements)

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“…Stress concentration was intensified after meltingsolidification process due to the large mismatch of CTE between Si and Sapphire, which brought in cracks formation in the bonding area. [50] Due to the heat accumulation, the heat affected zone can be larger than the bond which was ≈8.5 μm (Figure 4c). By contrast, a crack-free joint can be achieved in Sapphire-Ag-Si via optimized intermediate layer design with metal NPs film (Figure 4d).…”

Section: Resultsmentioning

confidence: 99%

Metal Nanoparticles Assisted Ultrafast Laser Plasmonic Microwelding of Oxide–Semiconductor Interconnects

Hu,

Lin,

et al. 2024

Small Methods

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Integration of wafer‐scale oxide and semiconductor materials meets the difficulties of residual stress and materials incompatibility. In this work, Ag NPs thin film is contributed as an energy confinement layer between oxide (Sapphire) and semiconductor (Si) wafers to localize the materials interaction during ultrafast laser irradiation. Due to the plasmonic effects generated within constructed dielectric–metal–dielectric structures (i.e., Sapphire–Ag–Si), thermal diffusion and chemical reaction between Ag and its neighboring materials facilitate the microwelding of Sapphire and Si wafers. Ag NPs can be totally sintered within the junction area to bridge oxide and semiconductor, while Al─O─Ag bond and Ag─Si bond are formed at Ag–Sapphire and Ag─Si interfaces, respectively. As‐received heterogeneous joint exhibits a high shear strength up to 5.4 MPa, with the fracture occurring inside Si wafer. Meanwhile, insertion of metal nanolayer can greatly relieve the residual stress‐induced microcracking inside the brittle materials. Such wafer‐scale Sapphire and Si interconnects thus show robust strength and excellent impermeability even after thermal shocking (−40 °C to 120 °C) for 200 cycles. This metal NPs layer‐assisted plasmonic microwelding technology can extend to broad materials integration, which is promising for high‐performance microdevices development in MEMS, MOEMS, or microfluidics.

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Section: Resultsmentioning

confidence: 99%

Metal Nanoparticles Assisted Ultrafast Laser Plasmonic Microwelding of Oxide–Semiconductor Interconnects

Hu,

Lin,

et al. 2024

Small Methods

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“…Additionally, the integration of aluminum layers with CFRP adherends is recognized for its efficacy in improving joint strength and averting delamination. 26,27 Furthermore, established industry practices, such as the incorporation of fillets, rounding of adhered materials, and the application of tapers, 16,[28][29][30] have proven effectiveness in reducing stress concentrations in SLJ, thereby enhancing overall joint performance.…”

Section: Introductionmentioning

confidence: 99%

Delamination prevention of composite joints with asymmetric carbon-fiber reinforced plastic adherends

Pires,

Carbas,

Marques

et al. 2024

Journal of Composite Materials

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The use of adhesive bonding in aeronautical applications has gained popularity due to its numerous advantages over traditional mechanical fastening methods. However, the issue of delamination still poses a significant challenge in fully embracing this technology in the industry. This study proposes a unique approach to optimize carbon fiber reinforced polymer (CFRP) single lap joints (SLJ) by introducing a curved joint design with varying adhesive thickness. The curvature is achieved through the intentional warpage caused by residual stresses resulting from an asymmetrical composite layup. While these residual stresses can potentially lead to cracks and distortions, this research aims to leverage their presence to enhance joint performance and mitigate delamination risks. A comprehensive analysis, involving both numerical simulations and experimental testing was conducted to compare the performance of the curved joint design with traditional configurations. The findings indicate that the curved joint design effectively prevents delamination while maintaining comparable joint strength. This demonstrates the potential benefits of employing curved joints for aeronautical components with curved geometries, affirming the feasibility and advantages of this approach. However, further optimization of the curved joint configuration is warranted to enhance its performance and expand its applicability to a broader range of applications.

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“…It should be noted that the Z-pinning method is known to be most effective, when compared to other methods, but it requires a complex manufacturing process, which increases the cost of the final product. The use of composite metal laminates [ 33 , 34 ] or hybrid composites [ 35 ] are other methods to improve strength of composite materials, which can increase transverse strength on the critical surface region [ 33 ] and/or result in a reduction of the shear stresses acting on the adhesive [ 35 ]. Recently, the use of hybrid bonded/riveted joints has also been found to be effective, since these joints are known to improve static strength and fatigue performance, and present higher energy absorption [ 9 ].…”

Section: Introductionmentioning

confidence: 99%

Developments in Laminate Modification of Adhesively Bonded Composite Joints

et al. 2023

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The use of carbon fibre reinforced polymer (CFRP) materials is increasing in many different industries, such as those operating in the aviation, marine, and automotive sectors. In these applications, composite parts are often joined with other composite or metallic parts, where adhesive bonding plays a key role. Unlike conventional joining methods, adhesive bonding does not add weight or require the drilling of holes, both of which are major sources of stress concentration. The performance of a composite joint is dependent on multiple factors and can be improved by modifying the adhesive layer or the composite layup of the adherend. Moreover, joint geometry, surface preparation, and the manufacturing methods used for production are also important factors. The present work reviews recent developments on the design and manufacture of adhesively bonded joints with composite substrates, with particular interest in adherend modification techniques. The effects of stacking sequence, use of thin-plies, composite metal laminates and its specific surface preparations, and the use of toughened surface layers in the composite adherends are described for adhesively bonded CFRP structures.

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Experimental and Numerical Study of Thermal Residual Stresses on Multimaterial Adherends in Single-Lap Joints

Cited by 12 publications

References 51 publications

Metal Nanoparticles Assisted Ultrafast Laser Plasmonic Microwelding of Oxide–Semiconductor Interconnects

Metal Nanoparticles Assisted Ultrafast Laser Plasmonic Microwelding of Oxide–Semiconductor Interconnects

Delamination prevention of composite joints with asymmetric carbon-fiber reinforced plastic adherends

Developments in Laminate Modification of Adhesively Bonded Composite Joints

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