2016
DOI: 10.1016/j.applthermaleng.2015.12.056
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Experimental and numerical study on phase change material (PCM) for thermal management of mobile devices

Abstract: As mobile devices become more complex and higher in performance despite the smaller in size, heat concentration at localized areas has become a problem. In recent years, passive cooling using phase change materials (PCMs) have drawn attention as thermal management methods for mobile devices. PCMs reduce the temperature increase rate due to their latent heat properties. This reduction in the temperature increase rate is called a "delay effect". Moreover, microencapsulated PCMs (MPCMs) are attracting attention b… Show more

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Cited by 137 publications
(53 citation statements)
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“…However, a small number of investigations with the aim of using PCM as part of the thermal management system of thin electronic devices (overall thickness in the range of 15 mm or smaller) have been published [10][11][12][25][26][27][28][29][30], and those are of great interest to the field of study and this work specifically. Numerical investigation on the thermal management of a modern computer tablet including thin PCM layers (0.5 mm) was performed by Sponagle and Groulx [11].…”
Section: Introductionmentioning
confidence: 99%
“…However, a small number of investigations with the aim of using PCM as part of the thermal management system of thin electronic devices (overall thickness in the range of 15 mm or smaller) have been published [10][11][12][25][26][27][28][29][30], and those are of great interest to the field of study and this work specifically. Numerical investigation on the thermal management of a modern computer tablet including thin PCM layers (0.5 mm) was performed by Sponagle and Groulx [11].…”
Section: Introductionmentioning
confidence: 99%
“…In order to avoid the breakdown of electronic devices, composites materials used in these devices should have high thermal strength and electrical insulator properties. Normally, high thermal conductive performance has been obtained by adding fillers due to the thermal conductive chains or networks produced by the fillers [6][7][8][9][10]. An outstanding challenge to enable such applications has been a thorough understanding of the Aluminum Nitride (AlN) Nano powder's electrical response with variation of frequencies.…”
Section: Introductionmentioning
confidence: 99%
“…In order to avoid the malfunction of electronic devices, composites materials used in these devices should have high thermal conductivity and electrical insulator properties. Normally, high thermal conductive performance has been obtained by adding fillers due to the thermal conductive chains or networks produced by the fillers [1][2][3][4][5]. In order to improve the thermal conductivity of composites, various inorganic ceramic fillers with high thermal conductivity have been introduced into insulation composites; notable example include silicon nitride (SiN) [6][7][8], silicon carbide (SiC) [9], boron nitride (BN) [10,11], alumina oxide (Al 2 O 3 ) [12][13][14], and alumina nitride (AlN) [15][16][17].…”
Section: Introductionmentioning
confidence: 99%