2020
DOI: 10.1007/s11664-020-08433-y
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Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects

Abstract: In this paper, the growth of intermetallic compound (IMC) layers is considered. After soldering, an IMC layer appears and establishes a mechanical contact between eutectic tin-silver solder bumps and Cu interconnects in microelectronic components. Intermetallics are relatively brittle in comparison with copper and tin. In addition, IMC formation is typically based on multi-component diffusion, which may include vacancy migration leading to Kirkendall voiding. Consequently, the rate of IMC growth has a strong i… Show more

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Cited by 7 publications
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“…( 33) and substituting it into the right hand side of Eq. ( 36) we come to the equation for e e 1x that, with the initial condition (37), has a solution:…”
Section: Stress Relaxation Behind the Reaction Frontmentioning
confidence: 99%
“…( 33) and substituting it into the right hand side of Eq. ( 36) we come to the equation for e e 1x that, with the initial condition (37), has a solution:…”
Section: Stress Relaxation Behind the Reaction Frontmentioning
confidence: 99%