“…While several reports have discussed the use of hybrid air-liquid cooling by servers and in data centers [14,15,16,17], there has been little discussion of air flow and ducting for the auxiliary components. The server chassis with a form factor 2OU (88.9 mm) incorporates Intel Xeon 2570 dual CPUs, each dissipating a thermal design power (TDP) of 115W; specifications of the processor available in [21].…”