Experimental Demonstration of Temperature Sensing with Packaged Glass Bottle Microresonators

Herter, Jonas; Wunderlich, Valentin; Janeczka, Christian; Zamora, Vanessa

doi:10.3390/s18124321

Cited by 27 publications

(7 citation statements)

References 22 publications

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“…Microbottles are extraordinary whispering-gallery-mode structures with additional axial confinement of the light along the bottle shape [10]. They were previously studied using tapered fibers where a high dense spectrum of resonances varying along the bottle curvature is observed [11]. Despite this, they remain potential for biosensing.…”

Section: Introductionmentioning

confidence: 99%

On-chip integration of optical microbottles for biosensing

Zamora¹,

Preussler²,

Herter³

et al. 2023

Frontiers in Biological Detection: From Nanosensors to Systems XV

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In the last decades, coupling strategies of optical microresonators have been intensively explored to develop highly sensitive and label-free miniaturized biosensors. This work presents an innovative semi-automatic assembly approach for glass microbottles on a photonic integrated circuit (PIC) with single-mode waveguides. Microbottles are extraordinary whispering-gallery-mode (WGM) structures with additional axial confinement of the light along the bottle shape. A high dense spectrum of resonances varying along the bottle curvature is typically observed. To excite these resonances, the evanescent field of waveguides is used, as it provides direct evanescent interaction, integration of multiple structures and mass production. Initial coupling tests in air yielded a Q factor of 10 4 at 1550 nm by employing an active alignment setup and a customized gripping tool. Lateral coupling tolerances of Δx = ±50 μm and Δy = ±2 μm for a bottle diameter of 180 m were also found. An existing assembly machine including a visual system, alignment system, high precision glue dispenser and UV light was used for the identification, placement and fixation of microbottles. A highest Q factor of 10 5 was determined after the attachment of a microbottle. Similar results were obtained with bio-chemical modified samples. A laser cutting method was also applied for reducing the fiber length of the microbottle. In this way the hybrid PIC can be compatible with microfluidics. The dedicated assembly process is a promising tool to bring optical resonators into practical use for label-free biochemical sensing but also for other applications such as quantum sensing and communication.

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Section: Introductionmentioning

confidence: 99%

On-chip integration of optical microbottles for biosensing

Zamora¹,

Preussler²,

Herter³

et al. 2023

Frontiers in Biological Detection: From Nanosensors to Systems XV

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“…37 Tapered structures are employed here, including silicon photonics. 38 These additional chips typically have more than one waveguide, enabling not only single, but also multiple coupling with mostly 250-or 125-μm pitches. Additionally, internal branching or pitch conversion structures can be included.…”

Section: Introductionmentioning

confidence: 99%

Hybrid photonic system integration using thin glass platform technology

Schröder

Schwietering

Bottger

et al. 2021

J. Optical Microsystems

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Demand for high integration of optoelectronic and micro-optical components into micro-electronic systems for communication, computing, medical, and sensing applications is increasing. Advanced hybrid packaging technologies are used to enhance glass-based substrates featuring electrical, thermal, and optical functionalities with laser diodes, modulators, isolators, photonic integrated circuits (PIC), beam-splitting components, and micro-lenses. Such glassbased substrates can be thin glass layers on large panels or more mini-bench-like boards that can be embedded into organic printed circuit boards (PCBs). Optical fiber interconnects, connectors, and electrical-optical integration platforms are used for higher level system integration and need to be miniaturized on module and board level to fulfill decreasing channel pitch requirements. We provide background on and discuss thin glass as a suitable base material for ion exchanged waveguide panels and interposers, precise glass structuring for posts and holders, the related high precision assembly techniques, and advanced fiber interconnects. Some examples of PCB photonic integration, micro-bench optical sub-assemblies, including PIC, and 3D optical resonator packages that combine most of these approaches will be shown. © The Authors.Published by SPIE under a Creative Commons Attribution 4.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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“…This unique combination has opened new and exciting paths in several areas that span from aerospace to medical, from transportation to energy [ 4 ]. Furthermore, there are numerous examples of 3D-printed devices suitable for chemical-, temperature- and pressure-sensing applications [ 5 , 6 , 7 ]. AM has also boosted new solutions in electromagnetics where it has been adopted for lenses [ 8 ], Frequency Selective Surfaces (FSS) [ 9 ], printed electronics [ 10 ], reflectarray [ 11 ], antennas for space [ 12 , 13 ] and several other devices [ 3 , 14 , 15 , 16 , 17 ].…”

Section: Introductionmentioning

confidence: 99%

Three-Dimensional Chipless RFID Tags: Fabrication through Additive Manufacturing

Terranova

Costa

Manara

et al. 2020

Sensors

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A new class of Radio Frequency IDentification (RFID) tags, namely the three-dimensional (3D)-printed chipless RFID one, is proposed, and their performance is assessed. These tags can be realized by low-cost materials, inexpensive manufacturing processes and can be mounted on metallic surfaces. The tag consists of a solid dielectric cylinder, which externally appears as homogeneous. However, the information is hidden in the inner structure of the object, where voids are created to encrypt information in the object. The proposed chipless tag represents a promising solution for anti-counterfeiting or security applications, since it avoids an unwanted eavesdropping during the reading process or information retrieval from a visual inspection that may affect other chipless systems. The adopted data-encoding algorithm does not rely on On–Off or amplitude schemes that are commonly adopted in the chipless RFID implementations but it is based on the maximization of available states or the maximization of non-overlapping regions of uncertainty. The performance of such class of chipless RFID tags are finally assessed by measurements on real prototypes.

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Experimental Demonstration of Temperature Sensing with Packaged Glass Bottle Microresonators

Cited by 27 publications

References 22 publications

On-chip integration of optical microbottles for biosensing

On-chip integration of optical microbottles for biosensing

Hybrid photonic system integration using thin glass platform technology

Three-Dimensional Chipless RFID Tags: Fabrication through Additive Manufacturing

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