Experimental determination of the Young's modulus of copper and solder materials for electronic packaging

Kraemer, Frank Alexander; Roellig, M.; Metasch, R.; Ahmar, Joseph Al; Meier, Karsten; Wiese, S.

doi:10.1016/j.microrel.2018.06.002

Cited by 8 publications

(4 citation statements)

References 15 publications

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“…In addition, there is no noticeable change in E s of CuFilm (≈70.8 GPa) in the investigated temperature range. [32] The phase change of PEG occurs at 52.7 °C, as previously shown in Figure 2c. The liquid phase is advantageous for conformal contact between mating surfaces.…”

Section: Resultssupporting

confidence: 64%

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Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials

Alayli,

Kim,

Cheon

et al. 2023

Adv Eng Mater

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Low‐cost thermal interface materials with high thermal conductivity (κ) and low total thermal resistance (Rt) receive considerable attention for thermal management. A copper film (CuFilm) is an excellent candidate due to the high κ (364 Wm−1 K−1) it possesses. However, the practical implementation is hindered by its high elastic modulus (Es = 70.8 GPa), inducing a high contact thermal resistance (Rc = 91.6 mm2 K W−1). Herein, the selective construction of electrically conducting or insulating layers on CuFilm to dramatically decrease Es, Rc, and Rt is reported. The highly electrically and thermally conducting layer is synthesized by incorporating in situ reduced copper nanoparticles (CuNPs, 35 vol%) and multiwalled carbon nanotubes embellished with CuNPs (1.5 vol%) in polyethylene glycol. The high effective κ (92.7 Wm−1 K−1) still maintains a low specimen thermal resistance (Rs = 4.9 mm2 K W−1), while the dramatically softened surface (Es = 5.7 GPa) decreases Rc (8.3 mm2 K W−1), resulting in a very small Rt (13.2 mm2 K W−1). Alternatively, the electrically insulating but thermally conducting layer is constructed using aluminum nitride particles. The κ is still high (72.1 Wm−1 K−1) with a small Rt (47.5 mm2 K W−1). The facile fabrication based on a CuFilm enables cost‐effective thermal interface materials with tunable electrical and thermal properties.

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Section: Resultssupporting

confidence: 64%

“…In addition, there is no noticeable change in E s of CuFilm (≈70.8 GPa) in the investigated temperature range. [ 32 ]…”

Section: Resultsmentioning

confidence: 99%

Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials

Alayli,

Kim,

Cheon

et al. 2023

Adv Eng Mater

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“…Young’s modulus was calculated by the ratio of the stress value to its corresponding strain value. If a hybrid fiber of cross-sectional area S is pulled by a force F at each end, the fiber stretches from the original length L 0 to a new length L 1 E = stress strain = σ ε = F L 0 S ( L 1 − L 0 ) 0.25em …”

Section: Experimental Methodsmentioning

confidence: 99%

“…If a hybrid fiber of cross-sectional area S is pulled by a force F at each end, the fiber stretches from the original length L 0 to a new length L 1 . 39 …”

Section: Experimental Methodsmentioning

confidence: 99%

Fabrication of Wet-Spun Wool Keratin/Poly(vinyl alcohol) Hybrid Fibers: Effects of Keratin Concentration and Flow Rate

et al. 2023

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Sheep wool is one of the most common wastes derived from agriculture and also a great source of keratin. In this study, chemical reduction and alkali hydrolysis methods of extracting keratin from wool were studied for the purpose of reusing the waste wool, and the products were used to fabricate wet-spun hybrid fibers by mixing with PVA. The comparative yield of the two extraction methods was investigated, and the optimal precursor concentration ratio for keratin extraction was identified. The effects of keratin concentration and wet-spinning flow rate on the mechanical properties of fabricated fibers were studied. Therefore, this study encourages the further investigation of wool keratin-based hybrid biomaterials, which could provide a new way to reuse waste wool.

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Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings

Niu

Chen

Shen

et al. 2019

J Mater Sci: Mater Electron

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Experimental determination of the Young's modulus of copper and solder materials for electronic packaging

Cited by 8 publications

References 15 publications

Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials

Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials

Fabrication of Wet-Spun Wool Keratin/Poly(vinyl alcohol) Hybrid Fibers: Effects of Keratin Concentration and Flow Rate

Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings

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