Experimental Investigation and Optimization of Wire Electrical Discharge Machining for Surface Characteristics and Corrosion Rate of Biodegradable Mg Alloy
“…With increasing T on , there is increased spark duration which attributes to an increase in discharge energy, causing large vapor bubbles to form, which expand and collapse under the electric field, resulting in the formation of large craters. 39 The larger the crater, the more will be the SR. With an increase in T off , spark frequency decreases, which reduces the discharge energy and hence there is a decrease in SR.Figure 6.Effect plots for surface roughness.…”
Monocrystalline silicon wafers are widely used as the primary material for solar cell production in the photovoltaic industry, owing to their high efficiency and sleeker aesthetic. Wafering is the primary process towards wafer production. The existing wafering processes have limitations of cracking, chipping, and high kerf loss, arising the need for cost-efficient and precise methods to produce wafers. In the present experimental work, an attempt has been made to explore the potential of Wire Electro-discharge Machining (WEDM) for wafer production and to gain an understanding of the effects caused by pulse on time (Ton), pulse off time (Toff), peak current (Ip), wire tension (WT), and wire feed rate (WFR) during the wafering process to achieve the optimal parametric setting for attaining maximum wafering speed and minimum surface roughness. The work material used was P-type monocrystalline silicon. Wafers thickness of 250 μm was produced, avoiding edge chipping. The experimentation was planned according to the face-centered central composite design. The obtained results were statistically analyzed, and response surface methodology (RSM) was used to model the wafering speed and surface roughness. From the analysis of experimental results, it was noticed that at the higher level of Ton and Ip, a maximum wafering speed of 2.574 mm/min was attained. In contrast, the minimum surface roughness of 1.57 μm was achieved at the lower level of Ton and Ip. The most significant process variables that influence the wafering speed and surface roughness are the Ton, Toff, and Ip. Micrographs of the wafer surface reveal the presence of micro craters, but there was no evidence of micro-cracks. The multi-objective optimization of the responses was done using the desirability approach, and the optimized values of wafering speed and surface roughness attained were 0.989 mm/min and 1.57 μm, respectively.
“…With increasing T on , there is increased spark duration which attributes to an increase in discharge energy, causing large vapor bubbles to form, which expand and collapse under the electric field, resulting in the formation of large craters. 39 The larger the crater, the more will be the SR. With an increase in T off , spark frequency decreases, which reduces the discharge energy and hence there is a decrease in SR.Figure 6.Effect plots for surface roughness.…”
Monocrystalline silicon wafers are widely used as the primary material for solar cell production in the photovoltaic industry, owing to their high efficiency and sleeker aesthetic. Wafering is the primary process towards wafer production. The existing wafering processes have limitations of cracking, chipping, and high kerf loss, arising the need for cost-efficient and precise methods to produce wafers. In the present experimental work, an attempt has been made to explore the potential of Wire Electro-discharge Machining (WEDM) for wafer production and to gain an understanding of the effects caused by pulse on time (Ton), pulse off time (Toff), peak current (Ip), wire tension (WT), and wire feed rate (WFR) during the wafering process to achieve the optimal parametric setting for attaining maximum wafering speed and minimum surface roughness. The work material used was P-type monocrystalline silicon. Wafers thickness of 250 μm was produced, avoiding edge chipping. The experimentation was planned according to the face-centered central composite design. The obtained results were statistically analyzed, and response surface methodology (RSM) was used to model the wafering speed and surface roughness. From the analysis of experimental results, it was noticed that at the higher level of Ton and Ip, a maximum wafering speed of 2.574 mm/min was attained. In contrast, the minimum surface roughness of 1.57 μm was achieved at the lower level of Ton and Ip. The most significant process variables that influence the wafering speed and surface roughness are the Ton, Toff, and Ip. Micrographs of the wafer surface reveal the presence of micro craters, but there was no evidence of micro-cracks. The multi-objective optimization of the responses was done using the desirability approach, and the optimized values of wafering speed and surface roughness attained were 0.989 mm/min and 1.57 μm, respectively.
“…made of copper or molybdenum as a machining tool electrode to establish a discharge channel via the application of impulse voltage between positive and negative electrodes of the workpiece and the wire electrode backed by the pulsed power supply of the machine tool. Making use of the instantaneous high temperature induced in the discharge channel by collisions of charged particles, the material on the surface melts and vaporizes, resulting in removal of material from the workpiece [221,222] . Xu et al [190] studied the influence of the number of power tubes on the performance of a workpiece surface by machining an AZ91D magnesium alloy using a high-speed wire electrical discharge machine (WEDM-HS).…”
Thanks to its excellent mechanical properties, magnesium alloys have many potential applications in the aerospace and other fields. However, failure to adequately solve corrosion problems of magnesium alloy becomes one of the factors restricting its wide use in many industrial fields. Inspired by nature, researchers designed and fabricated bio-inspired water-repellent (superhydrophobic and slippery liquid-infused porous surface) surfaces with special wetting properties by exploring the surface microstructures of plants and animals such as lotus leaf and nepenthes pitcher, exhibiting excellent corrosion-resistant performance. This article summarizes the research progress on corrosion resistance of magnesium alloys with bio-inspired water-repellent properties in recent years. It mainly introduces the corrosion reasons, types of corrosion of magnesium alloys, and the preparation of magnesium alloys with bio-inspired water-repellent properties to improve corrosion resistance. In particular, it is widely used and effective to construct water-repellent and anti-corrosion coating on the surface of magnesium alloy by surface treatment. It is hoped that the research in this review can broaden the application range of magnesium alloys and provide a powerful reference for the future research on corrosion resistance of magnesium alloys.
“…2 Surface roughness also increases as the SV decreases because of melting of work material in a narrow spark gap due to enormous ionization. 31 Remaining process parameter such as T off and WF are insignificant with surface quality. A quadratic SR regression model with all the input variables has been found most suitable with R 2 value 0.9990 and adjusted R 2 0.9983 as shown in Table 4.…”
Section: Statistical Regression Models For Mrr Sr and Kfmentioning
confidence: 99%
“…This GREG is "larger the better" type quality attribute; hence, highest-grade value provides the best compromised values of response characteristics. 31 The desirability value computed in Supplementary table 8 varies from 0.413 to 0.734. The input parameters corresponding to the highest value of GREG (0.734) are considered as optimized parameters.…”
In components manufacturing, the Wire EDM is more popular due to its outstanding features of high dimensional accuracy, lower cost of production and good surface finish as there is no physical contact between the wire and work piece. However, for the steel with higher hardness, it is difficult to obtain these features up to the required extent. Moreover, with the help of optimum process parameters selection the WEDM performance characteristics should be improved. The most commonly studied responses for this process are material removal rate (MRR), Surface finish, Kerf width, wire consumption, roundness error. Among these, the responses like Kerf width, MRR and surface roughness are the primary responses. It is observed that pulse on time, pulse off time, servo voltage, peak current and wire feed are the influencing input parameters to these primary responses. Therefore, in the present work, the optimal level of input parameters is estimated for these responses using the Grey-Entropy-Fuzzy (GEF) and Genetic Algorithm (GA) during wire EDM of steel grade DC53 with high hardness of HRC58normally used in stamping dies, injection moulding and compression Moulding etc. To convert the multi objective problem into a single objective, the grey relational coefficient (GRC) has been calculated using Grey Relational Analysis and the weight-age of each response is approximated during the entropy method. To estimate the relation among the input parameters and single objective (GRC) fuzzy mathematical modelling technique termed as GEF has been applied. The optimal performance has been calculated using GA and GEF model is considered as fitness function. Five conformational tests on optimum parameter combination suggested by GA has been performed. The predicted values and experimental values have been found to be in good agreement with a standard error of 3.31% hence the prediction performance of the GREG-Fuzzy is quite satisfactory.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
