2019
DOI: 10.1007/s12633-019-00197-3
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Experimental Investigation for Performance Study of Wire Electrochemical Spark Cutting of Silica Epoxy Nanocomposites

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Cited by 11 publications
(3 citation statements)
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“…Width at beginning of cutting found always higher than the width during continuous cutting [124]. A study on machining of silicon dioxide epoxy nanocomposite by TW-ECDM reveals that MRR reduces with an increase in silica concentration in the workpiece [125].…”
Section: Traveling Wire Ecdmmentioning
confidence: 88%
“…Width at beginning of cutting found always higher than the width during continuous cutting [124]. A study on machining of silicon dioxide epoxy nanocomposite by TW-ECDM reveals that MRR reduces with an increase in silica concentration in the workpiece [125].…”
Section: Traveling Wire Ecdmmentioning
confidence: 88%
“…Composite material Process Drill/wire diameter Jain et al 18 Kevlar-fiber epoxy and glass-fiber epoxy Traveling wire Wire = 600 mm Liu et al 19 Particulate reinforced aluminum alloy 6061 Traveling wire Wire = 180 mm Liu et al 20 Particulate reinforced aluminum alloy 6061 Grinding Hollow drill = 100 mm (thickness of wall) Manna and Malik 21 E-glass-fiber epoxy Traveling wire Wire = 200 mm Shamim et al 22 Al6063/SiC/10p metal matrix composite Traveling wire Wire = 250 mm Kumar et al 23 SiC reinforced z-pinned composite Traveling wire Wire = 250 mm Gupta et al 24 Glass fiber reinforced epoxy Drilling Drill = 400 mm Antil et al 25 SiC reinforced polymer matrix composite Drilling Drill = 400 mm Yadav et al 26 Silica epoxy nano-composites Traveling wire Wire = 150 mm delaminated fibers from the drilled hole. The experimental setup used for the study is shown in Figure 2.…”
Section: Authorsmentioning
confidence: 99%
“…The effects of applied voltage, electrolyte concentration, and line speed on the material removal rate and slit width were analyzed. Pallvita Yadav [ 20 ] studied the cutting of silica epoxy nanocomposites, and discussed the effects of voltage, concentration, wire-speed, pulse width, and silicon particle concentration on the material removal rate and surface roughness.…”
Section: Introductionmentioning
confidence: 99%