Experimental investigation of a vapour chamber heat spreader with hybrid wick structure

Velardo, Jason; Date, Abhijit; Singh, Randeep; Nihill, Jack; Date, Ashwin; Phan, Thanh Long; Takahashi, Makoto

doi:10.1016/j.ijthermalsci.2019.02.009

Cited by 38 publications

(8 citation statements)

References 24 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Basic wick structures employed inside the VC are the groove, mesh, foam, and sintered wick. [76][77][78][79][80][81] These wick structures are discussed in detail in the section Wick of this paper.…”

Section: Vapour Chamber Performance Ratingmentioning

confidence: 99%

“…It is found after experimental studies that the evaporation resistance dominates in the total VC resistance. 70 Generally, the total resistance of VC ( R VC ) is expressed as the ratio of a temperature difference between the processor top surface ( T h ) and the heat sink ( T C ) to the total heat transfer rate ( Q ) 71,72 …”

Section: Working Principle Of a Vapour Chambermentioning

confidence: 99%

“…In another study, Velardo et al 80 used a hybrid wick by incorporating the screen mesh wick on the condenser side and the sintered powdered wick in combination with the screen mesh wick on the evaporator side. Excellent results were obtained for spreading heat effectively as compared with copper plates.…”

Section: Factors Affecting Thermal Performancementioning

confidence: 99%

See 2 more Smart Citations

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Chitnis

Dayal

Arora

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

Miniaturization and high performance are the two principal requirements of modern electronics. All commercial applications demand reliable performance at high operational efficiency for prolonged service life. In order to meet all these requirements, the cooling system should be able to handle large heat fluxes packed in compact spaces and take away the heat as soon as possible to avoid overheating of the chip. Phase change heat transfer devices can handle large heat fluxes on account of latent heating. Lately, vapour chambers (VCs) are found to be promising heat spreaders as they are passive two-phase heat transfer devices. They effectively eliminate the hotspots, transferring high heat fluxes with better efficiencies and offer lower thermal resistance compared to the conventional cooling techniques. A detailed review of the latest research and advancements in the field of VCs is presented in this paper, including the effect of different thermo-physical parameters on their performance. Finally, all the major findings are summarized, including the future scope of development in a systematic manner.

show abstract

Section: Vapour Chamber Performance Ratingmentioning

confidence: 99%

Section: Working Principle Of a Vapour Chambermentioning

confidence: 99%

See 1 more Smart Citation

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Chitnis

Dayal

Arora

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

show abstract

“…In practice, the evaporator wick is a composite wick of sintered copper powder-mesh with multi-artery structures made of several sintered powder bars and uniform radial grooves in the evaporator wick on a thin evaporator zone, demonstrated good thermal-hydraulic performance at high heat flux (Wang et al, 2020). In case the vapor chamber had sintered powder and screen mesh wicks on the evaporator, and a screen meshes wick on the condenser, which was around half what would be achieved with an equivalent copper heat spreader (Velardo et al, 2019). By observation, the copper foam wick exhibits a better heat transfer performance and adaptability to the cooling water temperature than that copper mesh wick, given that the copper foam wick has a larger capillary performance parameter and a smaller contact thermal resistance (Li et al, 2019).…”

Section: Introductionmentioning

confidence: 99%

Transient thermal performance of constant fill ratio vapor chamber with different coolants

Wiriyasart

Naphon

2021

JTST

View full text Add to dashboard Cite

In this study, a constant fill ratio vapor chamber using water and ferrofluid as the coolants on the thermal performance and thermal optimization to provide the cooling range are presented. The liquid flow rate of the condenser side ranges from 0.029−0.099 kg/s, the input power of 100−300 W, heat source size of 30 mm × 30 mm, and the water and ferrofluid with φ=0 %, φ=0.005 % and φ=0.05 % as coolants are investigated. The results indicate that the minimum thermal resistance of a traditional vapor chamber of 0.126 o C/W at m o = 0.075 kg/s and vapor chamber with a mini channel of 0.077 o C/W at m o = 0.049 kg/s at φ=0.005 % are obtained. The vapor chamber with and without mini channel at a certain fill ratio of 26 % and 33 %, the heat source size of 30 mm × 30 mm, and the mass flow rate of ≥ 0.042 kg/s are withstanding the heat load range from 100-200 W. However, to achieve the high heat load range from 100-300 W, the vapor chamber with mini channel using the Fe3O4 ferrofluid φ=0.005 % is covering the entire cooling range and is recommended in electronic cooling applications.

show abstract

“…A hybrid structure improves the heat pipe performance by the conciliation of two common capillary structures (Paiva & Mantelli, 2015). Some studies available in the literature about different capillary structure technologies of heat pipes for application in the thermal management of electronic packaging are those by Obata, Fukushima, Alves, Bazani, and Paschoalini (2016), Gabsi, Maalej, and Zaghdoudi (2018), Grissa, Benselama, Lataoui, Bertin, and Jemni (2018), He et al (2018), Han, Wang, and Liang (2018), Santos, Alves, Oliveira, and Bazzo (2018), Liu, Li, and Fan (2019), Tian, He, Liu, and Liu (2019), Velardo et al (2019), He et al (2020), Xiau et al (2020), and Zhou, Li, Chen, Deng, and Gan (2020).…”

Section: Introductionmentioning

confidence: 99%

Experimental research of capillary structure technologies for heat pipes

et al. 2020

View full text Add to dashboard Cite

This paper presents an experimental study on three different capillary structure technologies of heat pipes for application in the thermal management of electronic packaging. The first capillary structure is that of axial grooves manufactured by wire electrical discharge machining (wire-EDM). The sintering process with copper powder produced the second heat pipe. Finally, a hybrid heat pipe was made by the combination of the two previous methods. The heat pipes were produced using copper tubes with an outer diameter of 9.45 mm and a length of 200 mm, and were tested horizontally at increasing heat loads varying from 5 to 35 W. The working fluid used was distilled water. The experimental results showed that all capillary structures for heat pipes worked successfully, so the studied manufacturing methods are suitable. Nonetheless, the hybrid heat pipe is the best, due to the lowest thermal resistance presented.

show abstract

Experimental investigation of a vapour chamber heat spreader with hybrid wick structure

Cited by 38 publications

References 24 publications

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Transient thermal performance of constant fill ratio vapor chamber with different coolants

Experimental research of capillary structure technologies for heat pipes

Contact Info

Product

Resources

About