Experimental Investigation of Micro fins for Heat Transfer Enhancement by using Copper, Aluminum and Aluminum with Paint Coating as a Micro fins

Abstract

Computer applications have lately embraced micro technologies. Microtechnologies are now being used in many cooling systems, but the thermal efficiency of micro-fins under forced convective heat transfer conditions is still a little bit of an unknown. Despite previous research, micro finned array architecture cannot be optimally optimized based on Heat transfer coefficients and fine geometry correlations. This study first time integrates a variety of heat sink measurements to offer an overview of microfin behavior. Mass-specific heat transfer coefficient of penalties and efficiency of the fins.Results from an original experiment are combined in this process with the most recent data available in the literature. Microfins are always determined to be favorable in terms of material utilization. There may be advantages to using these light micro fins in applications that need a heat sink to have a minimum weight. In addition, the direction has a modest influence.