2013
DOI: 10.1016/j.enbuild.2013.07.019
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Experimental investigation of new biocomposite with low cost for thermal insulation

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Cited by 194 publications
(131 citation statements)
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“…Estimated data indicates that production and application of biodegradable polymers in different branches of industry will grow by over 30 % annually (Shen et al 2009). Therefore, searching for new biodegradable polymers and biocomposites with tailored performance properties Kwiecien et al 2014) and reasonable price (Chikhi et al 2013;Korol et al 2015a;Sałasińska and Ryszkowska 2015) received attention nowadays in many academic and industrial scientific centers all over the world.…”
Section: Introductionmentioning
confidence: 99%
“…Estimated data indicates that production and application of biodegradable polymers in different branches of industry will grow by over 30 % annually (Shen et al 2009). Therefore, searching for new biodegradable polymers and biocomposites with tailored performance properties Kwiecien et al 2014) and reasonable price (Chikhi et al 2013;Korol et al 2015a;Sałasińska and Ryszkowska 2015) received attention nowadays in many academic and industrial scientific centers all over the world.…”
Section: Introductionmentioning
confidence: 99%
“…The thermal conductivity of the bulk cake and of the twelve fiberboards was also clearly influenced by their density, and it tended to increase with increasing density (Figure 4a). Similar characteristics have been observed on several occasions, in particular for insulation boards made from durian peel and coconut coir (Khedari et al, 2003(Khedari et al, , 2004, wastes from tissue paper manufacturing and corn peel (Lertsutthiwong et al, 2008), cotton stalk fibers (Zhou et al, 2010), coconut husk and bagasse (Panyakaew & Fotios, 2011), sunflower pith (Vandenbossche et al, 2012, hemp fibers (Benfratello et al, 2013), date palm fibers (Chikhi et al, 2013), and sunflower cake from whole plant (Evon et al, 2014). At the same time, the thermal resistance logically decreased (Figure 4b), and these trends were observed at all three temperatures.…”
Section: Influence Of Molding Conditions On Heat Insulation Propertiementioning
confidence: 61%
“…The thermal conductivity of insulation boards is often influenced by their densities (Khedari et al, 2003(Khedari et al, , 2004Lertsutthiwong et al;Zhou et al, 2010;Panyakaew & Fotios, 2011;Vandenbossche et al, 2012;Benfratello et al, 2013;Chikhi et al, 2013), and low-density materials have the lowest thermal conductivities. As an example, the thermal conductivity of an insulation board from sunflower pith is only 38.5 mW/m K at 25 °C with a board density of 36 kg/m 3 (Vandenbossche et al, 2012).…”
Section: Introductionmentioning
confidence: 99%
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