“…The main reasons for the selection of Cu-based SMA systems are the low costs, easy fabrication and also much higher heat and electrical conducivity of these alloy systems as compared to NiTi ones. But, Cu-based SMAs have some drawbacks that are tried to be improved such as thermal instabilities, martensite stabilization and brittle nature and weak mechanical properties (low cold workability) stemmed from mainly their microstructural properties such as the large grain sizes, accumulation of secondary phases or impurities along the grain boundaries, high degree of order and also high elastic anisotropy in the β-phase [7,[23][24][25]. A common and simple way to modify microstructure and reduce the grain size for improving these drawbacks and also to change characteristic martensitic transformation temperatures, SME, SE or other properties is to add some ternary, quaternary or more extra additive elements such as Ti, V, Co, Mn, Zr, Ce, Fe, Ni, B, Be, Mg, Sn or C [7,18,19,[22][23][24][26][27][28][29][30][31][32][33][34][35].…”