2018
DOI: 10.1016/j.icheatmasstransfer.2018.08.003
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Experimental investigation on paraffin wax integrated with copper foam based heat sinks for electronic components thermal cooling

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Cited by 161 publications
(26 citation statements)
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“…Figure 19 shows the computational domain of the paraffin/copper foam composite PCM with enclosure dimensions. Rehman et al 47,48 experimentally studied the effect of inserting copper metal foam in three varieties of paraffin wax. The porosity of the metal foam was 97%, and the density was 35 pores per inch.…”
Section: Application Of Pcm In the Thermal Management Of Electronic Cmentioning
confidence: 99%
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“…Figure 19 shows the computational domain of the paraffin/copper foam composite PCM with enclosure dimensions. Rehman et al 47,48 experimentally studied the effect of inserting copper metal foam in three varieties of paraffin wax. The porosity of the metal foam was 97%, and the density was 35 pores per inch.…”
Section: Application Of Pcm In the Thermal Management Of Electronic Cmentioning
confidence: 99%
“…For RT35HC/copper foam, a maximum reduction of 25% was found. A capture and scanning electron microscope structure of the copper metal foams were given in Figure 20 47 . Diani and Campanale 49 have experimentally and numerically studied the melting process of PCM (paraffin wax) incorporated in a metallic aluminum foam, see Figure 21.…”
Section: Application Of Pcm In the Thermal Management Of Electronic Cmentioning
confidence: 99%
See 1 more Smart Citation
“…Foam material is a type of porous, lightweight, high-strength, low-density media [1], which has high heat transfer characteristics and strong flow mixing characteristics due to its inherent properties such as high porosity, large specific surface area, disordered pore distribution, tortuous flow path [2]. Hence, foam materials are widely used in various heat exchange fields, including heat exchangers [3], heat sinks [4][5][6], electronic cooling [7], cooling towers [8], volumetric absorbers [9][10][11], catalytic reactors [12,13], etc.…”
Section: Introductionmentioning
confidence: 99%
“…It was shown that the existence of PCM reduces the base temperature and it can be beneficial for electronic cooling. Besides these researches, some other studies [16][17][18][19][20] were also aimed the applications of PCM in heat sinks for electronic system cooling.…”
Section: Introductionmentioning
confidence: 99%