2018
DOI: 10.1007/s11669-018-0697-1
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Experimental Investigations of Phase Equilibria in Ternary Ag-Cu-Ga System

Abstract: Experimental study of phase equilibria in the ternary Ag-Cu-Ga system was carried out by using DTA/ DSC, isothermal equilibration and microscopic as well as x-ray analyses. DTA experiments were conducted for alloys, whose concentrations varied along two cross-sections determined by the ratio of mole fractions x Ag /x Cu-= 1:1 and x Ag /x Ga = 1:1. Equilibration of samples was carried out at 200, 450 and 650°C. The obtained information about phases in equilibrium was compared with the results of calculations of… Show more

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Cited by 6 publications
(3 citation statements)
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“…The Ga-poor compositions demonstrated superconducting transitions below 120 mK [34]. The recent studies of the phase diagram for bulk Ga−Ag specified that two crystalline phases in the Ga-rich alloys are almost pure gallium with α-Ga structure and Ag 3 Ga 2 intermetallic with space symmetry Pmmm [35,36].…”
Section: Discussionmentioning
confidence: 99%
“…The Ga-poor compositions demonstrated superconducting transitions below 120 mK [34]. The recent studies of the phase diagram for bulk Ga−Ag specified that two crystalline phases in the Ga-rich alloys are almost pure gallium with α-Ga structure and Ag 3 Ga 2 intermetallic with space symmetry Pmmm [35,36].…”
Section: Discussionmentioning
confidence: 99%
“…The gas atmosphere was pure argon of minimum mass fraction (99.9999 mass%) obtained from Air Products. DTA measurements were carried out on Ag-Au-Ga alloys along two cross-sections, with X Ag /X Ga = 1:1 and X Au /X Ga = 1:1, and in the temperature range from 473 K to 1300 K. The experimental procedure of DTA measurements is the same as in the case of Au-Ga system [28], Ag-In-Sb system [31], and Ag-Cu-Ga system [32]. The samples of the alloys were prepared from pieces of pure silver, gold, and gallium metals.…”
Section: Methodsmentioning
confidence: 99%
“…The low melting point (29.76 °C) and high boiling point (2403 °C) of Ga provide a wide temperature range for this unique metal to be used in liquid state. [5] With the wide use of lead-free solders in microelectronics packaging, the low melting point of Ga-based alloys and the possibility of forming intermetallic compounds [6,7] with other metals at low DOI: 10.1002/crat.202300230 temperatures make them a promising low-temperature bonding material in microelectronics. Some researchers have observed that the shear strength of joints welded with Ga-added solder can be significantly improved.…”
Section: Introductionmentioning
confidence: 99%